1ST085EN3F43I3VGAS

The 1ST085EN3F43I3VGAS is an Intel Stratix® 10 TX FPGA in a 1760-BBGA (FCBGA) package, offering 850,000 logic elements and 440 I/O for high-density programmable logic applications. Built on Intel's Stratix 10 TX architecture, the device integrates the HyperFlex® core architecture, high-speed dual-mode transceivers, and advanced packaging to address demanding bandwidth and performance requirements.

Targeted at systems requiring large logic capacity, high aggregate bandwidth, and rugged operation, this Stratix 10 TX part supports high-speed interconnects, hardened IP blocks for PCIe and Ethernet, and industrial-temperature operation for deployment in challenging environments.

Key Features

• Core and Logic  850,000 logic elements (cells) implemented with Intel HyperFlex® core architecture for improved core performance relative to previous generations.
• High-Speed Transceivers  Dual-mode transceivers capable of PAM4 (up to 57.8 Gbps) and NRZ (up to 28.9 Gbps) operation, supporting chip-to-chip, chip-to-module, and backplane use cases.
• Aggregate Bandwidth  Series-level capability to deliver multi-terabit aggregate bandwidth (datasheet cites over 8 Tbps for the family), suitable for high-throughput system designs.
• Memory  Internal RAM totaling 71,303,168 bits along with support for embedded eSRAM and M20K memory blocks as described in the Stratix 10 TX overview.
• Interfaces and Hardened IP  Hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks are available in the Stratix 10 TX family for common high-speed protocols.
• I/O and Package  440 general-purpose I/O pins in a 1760-FBGA (42.5 × 42.5 mm) package (1760-BBGA, FCBGA), optimized for dense board-level integration.
• Power and Voltage  Core voltage supply range from 770 mV to 970 mV, enabling targeted power delivery and management strategies.
• Operating Temperature  Industrial-grade operation across −40°C to 100°C for deployment in temperature-challenging environments.
• Standards and Compliance  RoHS compliant as indicated in the product data.

Typical Applications

• High‑Bandwidth Networking and Switches  Use the device's high aggregate bandwidth and hardened Ethernet MAC IP for packet processing, line cards, and switch fabrics.
• Backplane and Chip‑to‑Chip Interconnect  Dual-mode transceivers supporting PAM4 and NRZ enable high-speed backplane links and chip-to-chip communications in system racks.
• Telecom and Optical Transport  Leverage hardened protocol IP blocks and large logic capacity for forward error correction, framing, and protocol adaptation in transport equipment.
• Compute Offload and Embedded Processing  Implement custom accelerators and protocol offloads using the large logic element count and internal memory resources.

Unique Advantages

• Highly Integrated Fabric: Monolithic Stratix 10 TX core combined with heterogeneous transceiver tiles provides a compact platform for high-performance designs.
• Exceptional Logic Density: 850,000 logic elements enable complex custom logic, large RTL designs, and extensive accelerator implementations on a single device.
• Flexible High‑Speed I/O: 440 I/O pins and dual-mode transceivers support a wide range of high-speed interfaces and topologies.
• Industrial‑Grade Operation: Specified for −40°C to 100°C, suitable for industrial environments requiring extended temperature ranges.
• System-Level Bandwidth: Family-level transceiver and MAC capabilities support multi-terabit system designs where high aggregate throughput is required.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 1ST085EN3F43I3VGAS?

This Stratix 10 TX FPGA part combines very large logic capacity, extensive I/O, and high-speed dual-mode transceivers in a compact 1760-FBGA package, making it well suited for systems that demand high compute and bandwidth in constrained board space. Industrial-temperature rating and a defined core voltage range support robust deployment and predictable power planning.

Designers targeting high-throughput networking, backplane interconnects, telecom transport, or compute offload applications will find the 1ST085EN3F43I3VGAS aligns technical requirements with a platform that integrates advanced core architecture, hardened protocol IP, and the transceiver performance needed for next-generation systems.

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