1ST085EN2F43I2VGAS

The 1ST085EN2F43I2VGAS is an Intel Stratix® 10 TX field programmable gate array (FPGA) offered in a 1760-BBGA (FCBGA) surface-mount package. It combines a high-density programmable fabric with advanced transceiver and system features from the Stratix 10 TX family to address high-bandwidth, latency-sensitive applications.

Designed for industrial environments, this device provides 850,000 logic elements, 71,303,168 bits of on-chip RAM, and 440 I/O pins while operating over a 770 mV to 970 mV supply range and −40 °C to 100 °C temperature range.

Key Features

• High-density logic — 850,000 logic elements provide capacity for complex FPGA designs and large-scale custom logic integration.
• On-chip memory — 71,303,168 total RAM bits for buffering, packet processing, and implementation of memory-hungry algorithms.
• Advanced transceiver technology — Stratix 10 TX family dual-mode transceivers support both 57.8 Gbps PAM4 and 28.9 Gbps NRZ operation for chip-to-chip, module, and backplane links.
• Hardened system IP — Family documentation highlights hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC blocks available in the Stratix 10 TX series for common high-speed interfaces.
• I/O and package — 440 I/O pins in a 1760-BBGA (1760-FBGA 42.5 × 42.5 mm supplier package) surface-mount package suitable for compact system integration.
• Power and thermal — Low-voltage core operation (770 mV–970 mV) and industrial operating range (−40 °C to 100 °C) for robust deployments in demanding environments.
• Family-level innovations — Stratix 10 TX devices incorporate Intel Hyperflex core architecture, 14 nm FinFET technology, and heterogeneous 3D SiP transceiver tiles as described for the series.

Typical Applications

• High-speed networking and switch fabric — Implement packet processing, MAC layers, and traffic management leveraging the device's high I/O count and on-chip memory.
• Telecommunications and optical transport — Use dual-mode high-speed transceivers for PAM4 and NRZ links in chip-to-module and backplane systems.
• Data center and hyperscale interconnects — Deploy in applications requiring large aggregate bandwidth and low-latency data paths supported by Stratix 10 TX family capabilities.
• High-performance compute acceleration — Map compute kernels into the device's large logic and memory resources for hardware acceleration tasks.

Unique Advantages

• High logic capacity: 850,000 logic elements enable complex designs and large-scale integration of custom logic functions.
• Substantial embedded memory: Over 71 million bits of on-chip RAM reduce external memory dependence for many buffering and stateful processing tasks.
• Dual-mode high-speed I/O: Transceivers in the Stratix 10 TX family support both PAM4 and NRZ signaling for flexible link options across applications.
• Industrial-grade operation: Rated for −40 °C to 100 °C and surface-mount packaging for reliable operation in industrial systems.
• Compact, high-density package: 1760-BBGA (42.5 × 42.5 mm supplier package) balances I/O count and board-area efficiency for dense system designs.

Why Choose 1ST085EN2F43I2VGAS?

The 1ST085EN2F43I2VGAS delivers a blend of high-density programmable logic, substantial on-chip memory, and family-level Stratix 10 TX innovations such as Hyperflex core architecture and advanced transceiver options. Its industrial temperature rating, low-voltage core operation, and 440 I/O pins make it suitable for demanding networking, telecom, and compute-acceleration applications where bandwidth, integration, and reliability matter.

For engineering teams targeting scalable, high-performance hardware designs, this Stratix 10 TX device provides a robust platform backed by the series' hardened IP and packaging technologies.

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