1ST085EN3F43E3VG

The 1ST085EN3F43E3VG is a Stratix® 10 TX field programmable gate array (FPGA) IC featuring a high-density logic fabric and advanced packaging. This device combines a large logic capacity with substantial on-chip memory and extensive I/O to address bandwidth- and compute-intensive system designs.

Targeted at applications that require high logic density, significant internal RAM, and broad I/O capability, the device delivers a balanced platform for network infrastructure, telecom and compute acceleration where integration and performance matter.

Key Features

• Logic Capacity  Provides 850,000 logic elements for implementing complex digital designs and large-scale hardware accelerators.
• On‑chip Memory  Includes 71,303,168 total RAM bits to support buffering, packet processing, and intermediate DSP storage.
• I/O and Packaging  Offers 440 user I/O signals in a 1760‑BBGA (1760‑FBGA 42.5 × 42.5 mm) FCBGA package for dense system integration and board-level routing.
• Transceiver and Fabric Family Capabilities  Part of the Stratix® 10 TX family that includes high-performance transceiver and fabric innovations (series overview references dual‑mode transceivers and HyperFlex® core architecture).
• Power Supply  Core voltage supply range of 770 mV to 970 mV for core power management and system-level power budgeting.
• Operating Range and Grade  Extended grade device with specified operating temperature from 0 °C to 100 °C.
• Standards and Compliance  RoHS compliant.

Typical Applications

• High‑bandwidth Networking  Large logic capacity and extensive on‑chip RAM make this FPGA suitable for packet processing, line cards, and network switching fabric implementations.
• Telecommunications and Optical Transport  Stratix® 10 TX family capabilities support transceiver‑centric applications and backplane interfaces in telecom systems.
• Compute Acceleration and DSP  High logic density and substantial RAM enable hardware acceleration, DSP pipelines, and algorithm offload functions.
• Embedded Systems with High I/O Needs  With 440 I/O pins and a compact 1760‑FBGA package, the device fits systems requiring many external interfaces and tight board layouts.

Unique Advantages

• High integration density: 850,000 logic elements reduce partitioning across multiple devices and simplify complex system implementations.
• Significant internal RAM: 71,303,168 total RAM bits support deep buffering and state storage without immediate dependence on external memory.
• Broad I/O in compact package: 440 I/O in a 1760‑FBGA (42.5 × 42.5 mm) package enables dense board-level connectivity while conserving PCB area.
• Power‑tuned core supply: 770 mV–970 mV core voltage range allows designers to manage core power for performance and thermal targets.
• Extended temperature operation: Rated 0 °C to 100 °C for broader deployment environments where ambient conditions vary.
• Regulatory compliance: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose 1ST085EN3F43E3VG?

The 1ST085EN3F43E3VG delivers a combination of high logic capacity, significant on‑chip memory, and extensive I/O in a dense 1760‑FBGA package, making it suitable for demanding networking, telecom, and compute-acceleration applications. Its extended operating range and RoHS compliance add deployment flexibility while enabling integrated, high‑throughput system designs.

Design teams seeking a scalable FPGA platform with substantial resources for large hardware functions, buffering, and wide external connectivity will find this Stratix® 10 TX device aligned with system-level performance and integration goals.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and how 1ST085EN3F43E3VG can fit your next design.