1ST085EN3F43I3VG

The 1ST085EN3F43I3VG is an Intel Stratix® 10 TX field-programmable gate array supplied in a 1760-BBGA (42.5 × 42.5 mm) surface-mount package. The device integrates a high-density FPGA fabric with 850,000 logic elements and 71,303,168 bits of total on-chip RAM to address complex, high-throughput digital designs.

Designed for industrial applications, the Stratix 10 TX family features the Intel HyperFlex® core architecture and series-level advances such as high-speed transceivers and hardened interface IP. This part supports a 770 mV to 970 mV core supply range and operates from −40 °C to 100 °C, enabling deployment in demanding system environments.

Key Features

• Core Architecture  Intel Stratix 10 TX HyperFlex® core architecture (series-level) delivering increased core performance compared to previous-generation devices.
• Logic Density  850,000 logic elements provide the capacity to implement large, complex designs and multiple high‑throughput functions on a single device.
• On-Chip Memory  71,303,168 total RAM bits for large buffering, packet processing, and data-path storage.
• I/O  440 user I/O pins support wide external interfacing for high-bandwidth systems and complex multi-board or module designs.
• Package & Mounting  1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) flip-chip BGA, surface-mount package suitable for compact, board-level integration.
• Power  Core voltage supply range of 770 mV to 970 mV enables defined power delivery planning for system-level power design.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Series-Level Transceiver & IP Innovations  Stratix 10 TX family features dual-mode transceivers (PAM4/NRZ), hardened PCI Express Gen3 and high-speed Ethernet MAC IP blocks, and advanced packaging technologies (series-level).

Typical Applications

• High‑Speed Networking & Telecom  Implements packet processing, line cards, and switch/router functions that require large logic capacity and extensive I/O.
• Data Center & Accelerator Platforms  Supports compute acceleration and data-path offload implementations that need substantial on-chip RAM and logic resources.
• Backplane & Module Interfaces  Enables complex chip-to-chip or module-to-module interfaces where large I/O counts and advanced transceiver capabilities (series-level) are used.
• Industrial Systems & Control  Deploys in industrial applications that demand robust operation across −40 °C to 100 °C and a surface-mount BGA footprint for compact boards.

Unique Advantages

• High Logic Capacity: 850,000 logic elements allow consolidation of multiple functions and large custom accelerators into a single device.
• Substantial On‑Chip Memory: Over 71 Mbits of RAM reduces external memory dependence for buffering and state storage.
• Wide I/O Count: 440 I/Os simplify system-level interfacing and reduce the need for external multiplexing.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Advanced Packaging: 1760-BBGA flip-chip package enables dense board-level integration and supports high-pin-count connectivity.
• Power Specification Transparency: Defined core supply range (770 mV–970 mV) aids in power-supply design and thermal planning.

Why Choose 1ST085EN3F43I3VG?

The 1ST085EN3F43I3VG combines high logic density, large on-chip memory, and a broad I/O complement in a single industrial-grade Stratix 10 TX package. It is suited for engineers and system designers building high-throughput networking, data center, and industrial systems that require consolidated FPGA logic and predictable power and thermal characteristics.

Leveraging series-level Stratix 10 TX innovations such as the HyperFlex® architecture and advanced transceiver/IP options, this device offers a scalable platform for complex, long‑lifecycle designs where integration, capacity, and environmental resilience are priorities.

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