1ST085EN2F43I2VG

IC FPGA 440 I/O 1760FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 850000 1760-BBGA, FCBGA

Quantity 903 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O440Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs106250Number of Logic Elements/Cells850000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits71303168

Overview of 1ST085EN2F43I2VG – Stratix® 10 TX FPGA, 850,000 Logic Elements, 440 I/O, 1760-BBGA (FCBGA)

The 1ST085EN2F43I2VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) offered in a 1760-BBGA (FCBGA) package. It combines a high logic capacity and large on-chip RAM with the Stratix 10 TX family’s advanced HyperFlex® core architecture and high-speed transceiver technology to address bandwidth‑intensive, board‑ and system‑level designs.

Designed for industrial applications, this device delivers 850,000 logic elements, 71,303,168 bits of on-chip RAM, and 440 general-purpose I/O while operating across a 770 mV to 970 mV supply range and an ambient temperature range of −40 °C to 100 °C.

Key Features

  • Core architecture  Intel HyperFlex® core architecture (Stratix 10 TX family) designed to increase core performance relative to previous-generation architectures.
  • Logic capacity  850,000 logic elements providing substantial gate-level resources for complex logic, packet processing, and custom accelerators.
  • On-chip memory  71,303,168 total RAM bits for buffering, lookup tables, and state storage within the FPGA fabric.
  • High-speed transceivers  Stratix 10 TX family dual‑mode transceivers support PAM4 at 57.8 Gbps and NRZ at 28.9 Gbps for chip‑to‑chip, chip‑to‑module, and backplane connectivity (family-level feature).
  • Interfaces and hardened IP (family-level)  Family documentation details hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks to support common high-bandwidth protocols.
  • I/O and package  440 I/O pins in a surface-mount 1760-FBGA (42.5 × 42.5 mm) footprint, enabling dense board-level integration.
  • Power and thermal  Supported core voltage range from 770 mV to 970 mV and rated operating temperature from −40 °C to 100 °C for industrial environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Data center networking  High logic capacity, abundant on-chip RAM, and family transceiver support make this device suitable for aggregation, switching, and packet-processing functions.
  • Telecom and optical transport  Dual‑mode high-speed transceivers support PAM4 and NRZ signaling for chip-to-module and backplane connectivity in transport systems.
  • High-performance compute interconnects  Large logic and memory resources enable custom accelerators, protocol offloads, and low-latency interconnect implementations.
  • Board‑level system integration  Dense I/O and a compact 1760-FBGA package allow integration into space-constrained, high-density PCBs for industrial applications.

Unique Advantages

  • High programmable capacity: 850,000 logic elements enable complex designs and multiple concurrent functions on a single device.
  • Substantial on-chip RAM: 71,303,168 bits of RAM reduce external memory dependencies and improve data-path performance.
  • High-speed serial connectivity (family-level): Dual-mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ enable scalable, high-bandwidth links for modern systems.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments.
  • Dense I/O in a compact package: 440 I/Os in a 1760-FBGA (42.5 × 42.5 mm) footprint facilitates high-density board designs without excessive PCB area.
  • Low-voltage core operation: 770 mV to 970 mV supply range supports power-constrained system designs.

Why Choose 1ST085EN2F43I2VG?

The 1ST085EN2F43I2VG positions itself as a high-capacity, industrial‑rated Stratix 10 TX FPGA option for designers who need significant programmable logic, large on-chip memory, and support for high-speed serial links. Its combination of 850,000 logic elements, expansive RAM, and 440 I/O in a 1760-FBGA package delivers a balance of integration and performance for demanding board- and system-level applications.

Choosing this device gives design teams the scalability to implement complex protocols, packet processing, and data-path acceleration while maintaining industrial operating ranges and RoHS compliance. It is suited to engineers targeting high-bandwidth networking, telecom transport, and compute-interconnect use cases where integrated logic and memory capacity matter.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for 1ST085EN2F43I2VG.

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