1ST085EN2F43I2VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 440 850000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 903 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 440 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 106250 | Number of Logic Elements/Cells | 850000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 71303168 |
Overview of 1ST085EN2F43I2VG – Stratix® 10 TX FPGA, 850,000 Logic Elements, 440 I/O, 1760-BBGA (FCBGA)
The 1ST085EN2F43I2VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) offered in a 1760-BBGA (FCBGA) package. It combines a high logic capacity and large on-chip RAM with the Stratix 10 TX family’s advanced HyperFlex® core architecture and high-speed transceiver technology to address bandwidth‑intensive, board‑ and system‑level designs.
Designed for industrial applications, this device delivers 850,000 logic elements, 71,303,168 bits of on-chip RAM, and 440 general-purpose I/O while operating across a 770 mV to 970 mV supply range and an ambient temperature range of −40 °C to 100 °C.
Key Features
- Core architecture Intel HyperFlex® core architecture (Stratix 10 TX family) designed to increase core performance relative to previous-generation architectures.
- Logic capacity 850,000 logic elements providing substantial gate-level resources for complex logic, packet processing, and custom accelerators.
- On-chip memory 71,303,168 total RAM bits for buffering, lookup tables, and state storage within the FPGA fabric.
- High-speed transceivers Stratix 10 TX family dual‑mode transceivers support PAM4 at 57.8 Gbps and NRZ at 28.9 Gbps for chip‑to‑chip, chip‑to‑module, and backplane connectivity (family-level feature).
- Interfaces and hardened IP (family-level) Family documentation details hardened PCI Express Gen3 and 10/25/100 Gbps Ethernet MAC IP blocks to support common high-bandwidth protocols.
- I/O and package 440 I/O pins in a surface-mount 1760-FBGA (42.5 × 42.5 mm) footprint, enabling dense board-level integration.
- Power and thermal Supported core voltage range from 770 mV to 970 mV and rated operating temperature from −40 °C to 100 °C for industrial environments.
- Compliance RoHS compliant.
Typical Applications
- Data center networking High logic capacity, abundant on-chip RAM, and family transceiver support make this device suitable for aggregation, switching, and packet-processing functions.
- Telecom and optical transport Dual‑mode high-speed transceivers support PAM4 and NRZ signaling for chip-to-module and backplane connectivity in transport systems.
- High-performance compute interconnects Large logic and memory resources enable custom accelerators, protocol offloads, and low-latency interconnect implementations.
- Board‑level system integration Dense I/O and a compact 1760-FBGA package allow integration into space-constrained, high-density PCBs for industrial applications.
Unique Advantages
- High programmable capacity: 850,000 logic elements enable complex designs and multiple concurrent functions on a single device.
- Substantial on-chip RAM: 71,303,168 bits of RAM reduce external memory dependencies and improve data-path performance.
- High-speed serial connectivity (family-level): Dual-mode transceivers supporting 57.8 Gbps PAM4 and 28.9 Gbps NRZ enable scalable, high-bandwidth links for modern systems.
- Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments.
- Dense I/O in a compact package: 440 I/Os in a 1760-FBGA (42.5 × 42.5 mm) footprint facilitates high-density board designs without excessive PCB area.
- Low-voltage core operation: 770 mV to 970 mV supply range supports power-constrained system designs.
Why Choose 1ST085EN2F43I2VG?
The 1ST085EN2F43I2VG positions itself as a high-capacity, industrial‑rated Stratix 10 TX FPGA option for designers who need significant programmable logic, large on-chip memory, and support for high-speed serial links. Its combination of 850,000 logic elements, expansive RAM, and 440 I/O in a 1760-FBGA package delivers a balance of integration and performance for demanding board- and system-level applications.
Choosing this device gives design teams the scalability to implement complex protocols, packet processing, and data-path acceleration while maintaining industrial operating ranges and RoHS compliance. It is suited to engineers targeting high-bandwidth networking, telecom transport, and compute-interconnect use cases where integrated logic and memory capacity matter.
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