1ST085EN2F43E2VG

The 1ST085EN2F43E2VG is a Stratix® 10 TX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It delivers a large, high-bandwidth programmable fabric with 850,000 logic elements and 71,303,168 bits of on-chip RAM for designs requiring dense logic and substantial embedded memory.

Engineered for high-speed communications and compute-accelerated system designs, the device combines Stratix 10 TX family architecture innovations—such as the Intel HyperFlex core architecture and dual-mode transceivers—with a 1760-FBGA (42.5 × 42.5 mm) package and 440 user I/O pins to address applications that demand high I/O density, packet processing, and multi-gigabit serial links.

Key Features

• Core Architecture  Built on the Stratix 10 TX family architecture with Intel HyperFlex core concepts described in the device overview to deliver increased core performance.
• Logic Capacity  Provides 850,000 logic elements for complex RTL implementations and large FPGA designs.
• On-Chip Memory  71,303,168 total RAM bits of embedded memory to support large buffering, packet queues, and algorithm state storage.
• High-Speed Transceivers  Dual-mode transceivers supporting both PAM4 and NRZ operation with data-rate capability described for the Stratix 10 TX family (including up to 57.8 Gbps PAM4 and 28.9 Gbps NRZ in the device overview).
• Hardened Interfaces  Family-level hardened IP is described for PCI Express Gen1/Gen2/Gen3 and 10/25/100 Gbps Ethernet MACs with Reed–Solomon FEC options for NRZ and PAM4 signals.
• I/O and Package  440 device I/O pins in a high-density 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package; surface-mount mounting type for standard PCB assembly.
• Power and Supply  Core voltage supply range specified at 770 mV to 970 mV.
• Operating Range and Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS-compliant material status.

Typical Applications

• High‑Speed Networking  Use for line cards, packet processing, and MAC/FEC acceleration where multi‑gigabit transceiver bandwidth and embedded memory support are required.
• Data Center Interconnect  Ideal for backplane, chip‑to‑chip, and chip‑to‑module links leveraging the family’s dual‑mode transceivers and hardened Ethernet/PCIe IP.
• Telecom Infrastructure  Programmable switching, fronthaul/transport processing, and protocol conversion that benefit from high logic density and large on‑chip RAM.
• Compute Acceleration  Hardware accelerators and packet/flow engines that require significant logic resources and tight I/O integration.

Unique Advantages

• High Logic Density:  850,000 logic elements enable large-scale designs and complex custom logic without external ASICs.
• Broad On‑Chip Memory:  Over 71 million bits of embedded RAM reduce dependence on off‑chip memory for buffering and state retention.
• Multi‑Mode High‑Speed I/O:  Family-level support for PAM4 and NRZ transceiver modes lets designers target a wide range of serial link applications and data rates.
• Hardened Interface IP:  Built-in PCIe and Ethernet MAC/FEC options help accelerate time to market for networking and high-throughput systems.
• High I/O and Dense Package:  440 I/O in a 1760-FBGA footprint provides the I/O capacity and board‑level density needed for complex system integrations.
• Compliance and Material Status:  RoHS-compliant construction supports regulatory material requirements for commercial deployments.

Why Choose 1ST085EN2F43E2VG?

The 1ST085EN2F43E2VG combines substantial logic capacity, extensive embedded RAM, and high‑speed transceiver capabilities in a single, extended‑grade Stratix 10 TX device. It is well suited to engineers building high‑bandwidth networking, telecom, and compute acceleration platforms that require programmable flexibility, hardened interface IP, and dense I/O in a compact FCBGA package.

As part of the Stratix 10 TX family, this device aligns with the documented family features—such as the HyperFlex core approach and multi‑die packaging innovations—providing a scalable target for designs that may grow in logic, memory, or transceiver count while leveraging the same device architecture and tool ecosystem.

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