1ST085EN2F43E1VG

The 1ST085EN2F43E1VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) supplied in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) surface-mount package. This device combines a high-density logic fabric with large on-chip RAM and a rich set of I/O to address demanding bandwidth and integration requirements.

As a member of the Stratix 10 TX family, the device leverages the series' HyperFlex core architecture and heterogeneous transceiver technology to support high-throughput interfaces and complex system functions. It is intended for designs that require significant logic capacity, embedded memory, and high-speed connectivity while operating within an extended temperature range.

Key Features

• Logic Capacity  850,000 logic elements provide substantial programmable fabric for complex digital designs and custom hardware acceleration.
• On‑Chip Memory  71,303,168 total RAM bits to support large buffers, packet processing, and stateful algorithms within the FPGA fabric.
• High-Speed I/O  440 I/O pins to connect to peripherals, memory interfaces, and high-density board-level signaling.
• Transceiver and Series Capabilities  Stratix 10 TX devices feature dual-mode transceivers that support both PAM4 and NRZ operation, and the series includes hardened IP such as PCI Express Gen3 and Ethernet MAC with Reed-Solomon FEC (as documented for the Stratix 10 TX family).
• Core Architecture  Based on the Stratix 10 TX HyperFlex core architecture and Intel 14 nm tri-gate technology as described for the device family, enabling higher core performance at device level.
• Package and Mounting  1760-BBGA (supplier package: 1760-FBGA, 42.5 × 42.5 mm), surface-mount mounting for compact board integration.
• Power Supply  Core voltage range of 770 mV to 970 mV to match system power-rail requirements.
• Operating Range and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in standard and elevated ambient environments.
• Compliance  RoHS compliant.

Typical Applications

• Networking and Telecom Equipment  High logic density, large on-chip RAM, and the Stratix 10 TX family transceiver/IP features make this device suitable for switches, routers, and line cards requiring high aggregate bandwidth.
• Data Center Accelerators  Programmable fabric and large RAM resources are applicable to hardware acceleration tasks, inline processing, and protocol offload in data center platforms.
• Chip‑to‑Chip and Backplane Interfaces  The family-level transceiver capabilities and the device's I/O count support high-speed chip-to-chip, module, and backplane connectivity scenarios.
• High‑Performance Embedded Systems  The combination of logic, memory, and available hardened IP in the Stratix 10 TX family suits compute‑intensive embedded designs that require flexible hardware partitioning.

Unique Advantages

• High Logic Density: 850,000 logic elements provide room for large-scale custom logic, reducing the need for multiple devices.
• Large On‑Chip Memory: Over 71 million bits of RAM enable in‑fabric buffering and stateful processing without immediate reliance on external memory.
• Extensive I/O Count: 440 I/O pins accommodate diverse system interfaces and high pin-count peripherals.
• Series-Level High-Speed IP: Access to Stratix 10 TX family hardened IP (PCIe Gen3, Ethernet MAC with FEC) simplifies implementation of standard high-speed protocols.
• Robust Packaging: 1760-FBGA package (42.5 × 42.5 mm) delivers a compact, manufacturable footprint for dense system boards.
• Extended Operating Range: Extended grade 0 °C to 100 °C operation supports deployment in a wide range of commercial and elevated-temperature environments.

Why Choose 1ST085EN2F43E1VG?

The 1ST085EN2F43E1VG places substantial programmable resources, on-chip memory, and I/O into a single 1760-BBGA package, making it a practical choice for designs that need high integration and significant logic capacity. As part of the Intel Stratix 10 TX family, it benefits from the series' HyperFlex architecture and family-level high-speed IP, enabling designers to address demanding bandwidth and processing requirements.

Choose this device when your project requires large logic and memory resources, a high count of I/O, and support for high-throughput protocol implementations within an extended temperature range. Its combination of density, packaging, and family-level capabilities supports scalable, long-lived designs backed by documented Stratix 10 TX feature sets.

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