1ST085EN1F43I1VG

The 1ST085EN1F43I1VG is an Intel Stratix® 10 TX field programmable gate array (FPGA) supplied in a 1760‑BBGA FCBGA package. It combines high logic capacity with extensive I/O and family-level innovations such as the Intel HyperFlex® core architecture and high‑speed dual‑mode transceivers.

Designed for industrial applications that require large programmable fabric, abundant on‑chip RAM and high‑bandwidth serial connectivity, this device targets systems that need substantial logic density, flexible I/O and reliable operation across a wide temperature range.

Key Features

• Core & architecture  Built on the Intel HyperFlex® core architecture and Intel 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 TX family.
• Logic capacity  850,000 logic elements (logic cells) to implement large, complex designs.
• On‑chip memory  71,303,168 total RAM bits of embedded memory for buffering, packet processing and scratch storage; family documentation also references M20K internal SRAM blocks.
• I/O and transceivers  440 general I/O pins. Stratix 10 TX family transceivers support dual‑mode operation with PAM4 up to 57.8 Gbps and NRZ up to 28.9 Gbps for chip‑to‑chip, chip‑to‑module and backplane links.
• Hard IP support  Family-level hardened IP includes PCI Express Gen3 and 10/25/100 Gbps Ethernet MACs with Reed‑Solomon FEC options, as documented for Stratix 10 TX devices.
• Power and supply  Core voltage supply range specified at 770 mV to 970 mV to support the device’s power domains.
• Package & mounting  1760‑BBGA (FCBGA) surface‑mount package; supplier device package is 1760‑FBGA with dimensions 42.5 mm × 42.5 mm.
• Operating range & grade  Industrial grade with an operating temperature range of −40 °C to 100 °C. RoHS compliant.

Typical Applications

• High‑performance networking  Ethernet switching, routing and NIC acceleration leveraging high logic capacity and family support for 10/25/100 Gbps Ethernet MACs.
• Telecom and optical transport  Backplane and module connectivity using dual‑mode PAM4/NRZ transceivers for high aggregate bandwidth.
• Data center acceleration  FPGA‑based compute and packet processing functions that require large on‑chip RAM and extensive programmable logic.
• Test and measurement  High‑speed serial link characterization and protocol test systems using the device’s advanced transceiver capabilities.

Unique Advantages

• High logic density: 850,000 logic elements provide the capacity to implement complex, high‑throughput designs without repartitioning.
• Integrated high‑speed I/O: 440 I/O and family‑level dual‑mode transceivers enable direct connection to high‑bandwidth links and backplanes.
• Substantial on‑chip RAM: Over 71 million bits of embedded RAM reduces external memory dependence for buffering and dataflow tasks.
• Industrial temperature rating: Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Robust packaging: 1760‑BBGA FCBGA surface‑mount package with a 42.5 mm × 42.5 mm footprint supports dense board integration.
• Family innovations: Stratix 10 TX family features such as HyperFlex architecture and FinFET process technology provide a documented foundation for high performance and power‑efficient implementations.

Why Choose 1ST085EN1F43I1VG?

The 1ST085EN1F43I1VG delivers a combination of high logic capacity, extensive on‑chip memory and significant I/O resources in an industrial‑rated package. It is suitable for designs that require large programmable fabric and high‑bandwidth serial connectivity while operating across demanding temperature ranges.

Engineers building network, telecom, data center or test systems can leverage the documented Stratix 10 TX family capabilities—HyperFlex architecture, high‑speed transceivers and hardened protocol IP—to scale performance and integration while maintaining a compact board footprint.

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