1ST085EN1F43E1VG

The 1ST085EN1F43E1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 1760‑BBGA FCBGA package. It delivers high logic density and large on‑chip RAM for demanding programmable logic applications.

As part of the Intel Stratix 10 TX family, this device aligns with the family’s HyperFlex core architecture and high‑bandwidth design focus, making it suitable for high‑performance computing, networking, and bandwidth‑intensive systems that require substantial logic and memory resources.

Key Features

• Logic Density  850,000 logic elements for complex programmable designs and large-scale RTL implementations.
• Embedded Memory  71,303,168 total RAM bits to support large buffers, packet processing, and on‑chip data storage.
• I/O Capacity  440 user I/Os to connect high‑pin‑count interfaces and multiple high‑speed channels.
• Package & Mounting  1760‑BBGA (FCBGA) surface‑mount package; supplier package dimension 1760‑FBGA (42.5 × 42.5 mm) for compact, high‑density board layouts.
• Power Domain  Core voltage supply range 770 mV to 970 mV to align with low‑voltage, high‑performance FPGA core operation.
• Operating Temperature  Extended grade with an operating range of 0 °C to 100 °C for a broad set of commercial and extended‑environment applications.
• Regulatory Status  RoHS compliant.
• Family Innovations  Part of the Stratix 10 TX family which includes HyperFlex core architecture and high‑bandwidth transceiver technology, as described in the Stratix 10 TX device overview.

Typical Applications

• High‑performance networking and switching  Use the device’s high logic density and large on‑chip RAM to implement complex packet processing, forwarding, and buffering functions.
• Data center acceleration  Leverage the substantial logic and memory resources for custom accelerators, protocol offloads, and inline data processing.
• Telecommunications infrastructure  Suitable for programmable protocol engines and aggregation functions where many I/Os and large memory buffers are required.
• High‑density FPGA systems  Ideal for designs that require a compact FCBGA package with a high I/O count and significant on‑chip resources.

Unique Advantages

• High logic capacity: 850,000 logic elements enable implementation of large, complex designs without immediate need for multi‑device partitioning.
• Large embedded memory: Over 71 million RAM bits support substantial buffering and data‑intensive processing directly on the FPGA fabric.
• Broad I/O count: 440 I/Os provide flexibility to interface with multiple high‑speed peripherals and parallel buses.
• Compact high‑density package: 1760‑FBGA (42.5 × 42.5 mm) package reduces PCB footprint while enabling a high pin count for complex system integration.
• Extended temperature grade: 0 °C to 100 °C operating range suits a wide range of commercial and extended‑environment deployments.
• Low‑voltage core operation: 770–970 mV supply range supports modern low‑voltage FPGA core requirements.

Why Choose 1ST085EN1F43E1VG?

The 1ST085EN1F43E1VG brings together high logic density, extensive on‑chip RAM, and a large I/O complement in a compact 1760‑BBGA FCBGA package, making it a strong option for high‑performance, bandwidth‑focused designs. As a member of the Stratix 10 TX family, it benefits from the family’s documented architectural innovations and design resources.

This device is well suited to system architects and hardware engineers who need scalable, high‑capacity programmable logic with substantial embedded memory and I/O flexibility for compute, networking, and communications applications.

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