1ST040EH3F35I3VG

The 1ST040EH3F35I3VG is an Intel Stratix® 10 TX Field Programmable Gate Array (FPGA) packaged as a 1152-BBGA FCBGA device. It integrates a high density of programmable logic, substantial on-chip RAM, and a broad I/O complement to support complex digital systems.

Designed for industrial-grade use, the device combines 378,000 logic elements with 31,457,280 total RAM bits and 384 I/Os, providing a balanced platform for large-scale logic integration, buffering, and I/O connectivity within the specified supply voltage and temperature ranges.

Key Features

• Core / Logic Density  Provides 378,000 logic elements for implementing large-scale programmable logic and complex datapaths.
• On‑Chip Memory  31,457,280 total RAM bits to support deep buffering, large lookup tables, and state storage without external memory dependence.
• I/O Capacity  384 I/O pins to accommodate extensive peripheral, sensor, and interface connectivity requirements.
• Power Supply Range  Operates with a core voltage supply range of 770 mV to 970 mV, enabling compatibility with target power architectures.
• Package and Mounting  Supplied in a 1152-BBGA, FCBGA package (1152-FBGA, 35×35 supplier device package) designed for surface-mount assembly.
• Operating Temperature  Rated for −40 °C to 100 °C, supporting industrial-temperature deployments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control Systems  High logic density and large on‑chip RAM support complex control algorithms, real‑time decision logic, and local buffering in industrial automation equipment.
• Signal Processing  The combination of extensive logic resources and large RAM capacity is suited for implementing multi‑stage digital signal processing pipelines and data buffering.
• High‑Density I/O Systems  With 384 I/Os, the device can serve as the central programmable hub for systems requiring numerous interfaces, sensor aggregations, or protocol conversions.

Unique Advantages

• Substantial Logic Capacity: 378,000 logic elements enable integration of large designs that reduce the need for multiple discrete FPGAs or external glue logic.
• Large On‑Chip Memory: 31,457,280 RAM bits provide on‑device storage for buffering and state retention, simplifying external memory requirements.
• Robust I/O Count: 384 I/Os allow flexible interfacing with a wide range of peripherals and parallel data paths without external multiplexing.
• Industrial Temperature Range: Rated from −40 °C to 100 °C, the device supports deployment in industrial environments where extended temperature tolerance is required.
• Surface‑Mount, High‑Density Package: The 1152-BBGA (1152-FBGA, 35×35) packaging offers a compact footprint for board-level integration while supporting the device’s I/O and power requirements.
• Regulatory Compliance: RoHS compliance facilitates use in designs requiring lead-free materials and environmental regulatory adherence.

Why Choose 1ST040EH3F35I3VG?

The 1ST040EH3F35I3VG positions itself as a high‑capacity Stratix® 10 TX FPGA option for industrial designs that require substantial logic, ample on‑chip memory, and a broad I/O set in a surface‑mount BBGA package. Its specified voltage and temperature ranges make it suitable for robust, long‑lifecycle embedded systems.

Engineers and procurement teams targeting compact, high‑integration solutions will find this device appropriate for consolidating functionality on a single FPGA, reducing external components and simplifying board-level designs while maintaining compliance with RoHS requirements.

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