1ST040EH3F35I3XG

The 1ST040EH3F35I3XG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC supplied in a 1152-ball BGA package. It delivers high logic density and on-chip memory with a large I/O count for complex, programmable hardware designs. Specified for industrial use, the device supports surface-mount assembly and an extended operating temperature range for deployment in demanding environments.

Key Features

• Core Logic  378,000 logic elements provide substantial programmable logic capacity for complex designs.
• On-Chip Memory  31,457,280 total RAM bits available for buffering, state storage, and memory-intensive logic functions.
• I/O  384 user I/Os to support wide parallel interfaces and dense system integration.
• Power Supply  Device supply voltage range from 870 mV to 970 mV to match platform power architectures requiring sub-1V core rails.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package, 1152-FBGA (35×35) footprint, designed for surface-mount assembly in compact boards.
• Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for deployment across a wide range of environmental conditions.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Industrial systems  Industrial-grade temperature range and device grade suit programmable control, automation, and rugged embedded systems.
• High-density I/O modules  384 I/Os and high logic element count enable complex interface aggregation, protocol bridging, and parallel data handling.
• Memory-centric logic  Large on-chip RAM capacity supports buffering, packet processing, and LUT-based memory structures within the FPGA fabric.

Unique Advantages

• High logic density: 378,000 logic elements allow implementation of large, integrated FPGA designs without immediate need for external logic chips.
• Substantial on-chip RAM: 31,457,280 total RAM bits reduce dependence on external memory for many buffering and stateful functions.
• Wide I/O capability: 384 I/Os provide flexibility for interfacing to multiple peripherals and parallel front-end hardware.
• Industrial robustness: Industrial grade and −40°C to 100°C operating range enable use in temperature-challenging deployments.
• Compact system integration: 1152-BBGA (35×35) package supports high-density board designs with surface-mount assembly processes.
• Regulatory readiness: RoHS compliance facilitates integration into lead-free manufacturing environments.

Why Choose 1ST040EH3F35I3XG?

The 1ST040EH3F35I3XG combines substantial programmable logic, significant on-chip RAM, and a high I/O count within an industrial-grade BGA package, making it suitable for designers who need integrated, high-density FPGA resources in compact, surface-mount form factors. Its specified voltage range and temperature rating align with platforms requiring sub-1V core operation and extended environmental tolerance.

This device is appropriate for engineering teams developing complex embedded systems, industrial controls, and I/O-intensive modules that require long-term availability, scalability, and a robust FPGA fabric for iterative design and deployment.

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