1ST040EH3F35E3VG

The 1ST040EH3F35E3VG is a Stratix® 10 TX field programmable gate array (FPGA) IC designed to deliver large programmable logic capacity and substantial on-chip memory. This device combines 378,000 logic elements with 31,457,280 total RAM bits and 384 I/O to support complex, memory‑intensive digital designs.

Built in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package and specified for an operating temperature range of 0 °C to 100 °C, the part targets applications requiring high integration density and extended temperature operation while operating from a 770 mV to 970 mV core supply range.

Key Features

• Core Logic  Provides 378,000 logic elements for implementing large-scale programmable logic, custom datapaths, and complex state machines.
• On‑Chip Memory  Includes 31,457,280 total RAM bits to support buffer memory, large FIFOs, and memory‑centric algorithms without immediate external memory dependence.
• I/O Capacity  384 I/O pins enable broad interfacing options for peripherals, high‑speed links, and multi‑lane channels.
• Power Supply  Operates from a core voltage supply range of 770 mV to 970 mV to match low‑voltage system power architectures.
• Package and Mounting  1152‑BBGA (Supplier Device Package: 1152‑FBGA, 35×35) in a surface‑mount FCBGA format for compact system integration.
• Temperature and Grade  Extended grade device specified for 0 °C to 100 °C operating temperature, suitable for designs requiring extended thermal range.
• Compliance  RoHS compliant, meeting common lead‑free assembly and environmental requirements.

Typical Applications

• High‑density digital systems  Implements complex logic and parallel processing tasks that leverage 378,000 logic elements for custom acceleration and control.
• Memory‑intensive designs  Uses 31,457,280 RAM bits for large buffers, packet staging, and algorithmic storage within the FPGA fabric.
• Multi‑interface platforms  Employs 384 I/O to connect to multiple peripherals, sensors, and high‑pin‑count subsystems in a single device.
• Compact system integration  1152‑BBGA package supports high integration density in board layouts where PCB area and pin count are constrained.

Unique Advantages

• Large programmable fabric: 378,000 logic elements provide headroom for complex logic implementation and feature growth within a single device.
• Substantial on‑chip memory: 31,457,280 total RAM bits reduce reliance on external memory for many buffering and storage needs, simplifying BOM and board routing.
• High I/O count: 384 I/O enables broad connectivity for multi‑lane interfaces and extensive peripheral integration without external I/O expanders.
• Compact BGA package: 1152‑BBGA (35×35) supports dense system integration while maintaining a standardized surface‑mount footprint.
• Extended operating range: Specified 0 °C to 100 °C operating temperature and Extended grade help address designs that require wider thermal margins.
• RoHS compliant: Supports lead‑free assembly and environmental compliance requirements.

Why Choose 1ST040EH3F35E3VG?

The 1ST040EH3F35E3VG positions itself as a high‑capacity Stratix® 10 TX FPGA option for designs that require extensive logic resources, significant on‑chip memory, and plentiful I/O in a compact BGA package. Its combination of 378,000 logic elements, 31,457,280 RAM bits, and 384 I/O delivers a balance of performance and integration for memory‑centric and interface‑rich systems.

With an extended 0 °C to 100 °C operating range, a 770 mV to 970 mV core supply window, and RoHS compliance, this part is aimed at engineers and procurement teams seeking a scalable, high‑integration FPGA solution for demanding board‑level implementations.

Request a quote or submit an inquiry to obtain pricing and availability for the 1ST040EH3F35E3VG and to discuss how this Stratix® 10 TX FPGA can fit your project requirements.