1ST040EH2F35E2VG

IC FPGA STRATIX10TX 1152FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 384 31457280 378000 1152-BBGA, FCBGA

Quantity 422 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells378000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits31457280

Overview of 1ST040EH2F35E2VG – Stratix® 10 TX FPGA, 1152-BBGA FCBGA

The 1ST040EH2F35E2VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) supplied in a 1152-BBGA FCBGA package. It combines a large programmable logic capacity, substantial on‑chip RAM, and a high I/O count in a surface-mount, extended-grade device.

This device is suited to designs that require extensive logic resources and on-chip memory while operating within a core voltage range of 770 mV to 970 mV and an ambient temperature range of 0 °C to 100 °C.

Key Features

  • Logic Capacity 378,000 logic elements provide a large amount of programmable logic for complex designs.
  • On‑Chip Memory Total RAM of 31,457,280 bits for buffering, state storage, and memory‑intensive logic functions.
  • I/O 384 general purpose I/O pins to support multiple external interfaces and peripherals.
  • Power Supply Core voltage support from 770 mV to 970 mV.
  • Package & Mounting 1152‑BBGA (FCBGA) supplier package: 1152‑FBGA (35×35). Surface mount package for PCB assembly.
  • Operating Range Specified operating temperature from 0 °C to 100 °C; extended grade device classification.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High programmable logic capacity: 378,000 logic elements support extensive custom logic integration within a single device.
  • Large on‑chip RAM: 31,457,280 total RAM bits reduce the need for external memory in many buffering and storage use cases.
  • Substantial I/O count: 384 I/O pins simplify external connectivity and system integration.
  • Compact FCBGA package: 1152‑BBGA (35×35) package provides a high‑density solution for space‑constrained PCBs using surface‑mount assembly.
  • Defined power envelope: Support for a 770 mV–970 mV core voltage enables clear power supply selection during system design.
  • Extended grade with RoHS compliance: Extended grade classification and RoHS compliance support deployments requiring these attributes.

Why Choose 1ST040EH2F35E2VG?

The 1ST040EH2F35E2VG combines large logic capacity, significant on‑chip memory, and a high I/O count in a surface‑mount 1152‑BBGA FCBGA package. Its specified core voltage range and 0 °C to 100 °C operating range make it a clear match for projects that require these defined hardware characteristics.

This device is appropriate for designers and procurement teams seeking a single FPGA solution that consolidates logic, memory, and I/O resources while meeting extended‑grade and RoHS requirements.

Request a quote or submit a pricing and availability inquiry to receive details on purchasing and lead time for the 1ST040EH2F35E2VG.

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