1ST040EH2F35I1VG

The 1ST040EH2F35I1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package. It provides a high-density combination of programmable logic, on-chip RAM, and I/O resources aimed at designs that require large logic capacity, substantial embedded memory, and a high I/O count.

With 378,000 logic elements, 31,457,280 total RAM bits and up to 384 I/O, this device is positioned for applications that demand integrated digital logic, extensive data buffering, and robust I/O connectivity within an industrial temperature range.

Key Features

• Core Logic — 378,000 logic elements provide substantial programmable logic capacity for complex custom digital designs.
• On‑Chip Memory — 31,457,280 total RAM bits available for buffering, state storage, and intermediate data processing.
• I/O Resources — Up to 384 I/O pins to support wide external connectivity and parallel interfaces.
• Power — Operates from a core voltage supply range of 770 mV to 970 mV, supporting modern low‑voltage FPGA power architectures.
• Package — 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) for surface-mount PCB implementation.
• Temperature & Grade — Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Mounting — Surface mount package forms for standard PCB assembly processes.
• Compliance — RoHS compliant.

Typical Applications

• High‑density digital processing: Implement custom logic pipelines and wide datapaths using the device’s 378,000 logic elements and large on-chip RAM.
• Communications and networking: Use the 384 I/O pins for parallel interfaces, data plane processing, and protocol bridging where extensive I/O and buffering are required.
• Industrial control and automation: Deploy in systems needing robust operation across −40 °C to 100 °C and flexible programmable logic for control algorithms and I/O aggregation.
• Data buffering and packet handling: Leverage 31,457,280 bits of RAM for packet queues, FIFOs, and intermediate data storage in streaming or bursty workloads.

Unique Advantages

• High logic density: 378,000 logic elements enable complex, highly parallel designs without immediate need for multiple FPGAs.
• Substantial embedded memory: 31,457,280 RAM bits reduce dependence on external memory for many buffering and state storage needs.
• Extensive I/O capability: 384 I/O pins provide flexibility for wide buses, modular interfaces, and multiple peripheral connections.
• Industrial operating range: Rated from −40 °C to 100 °C to support deployment in temperature‑sensitive industrial environments.
• Compact surface‑mount package: 1152‑BBGA FCBGA package (1152‑FBGA, 35×35) balances high pin count with PCB space efficiency.
• Regulatory compliance: RoHS compliance supports environmentally conscious design requirements.

Why Choose 1ST040EH2F35I1VG?

The 1ST040EH2F35I1VG brings together large programmable logic capacity, significant on‑chip RAM, and a high I/O count in a single industrial‑grade FCBGA package. These attributes make it suitable for designs that require integrated, high‑density logic and memory resources while maintaining operation across a wide temperature range.

This device is well suited for engineers and teams building complex digital systems that benefit from consolidated logic, embedded memory, and flexible external connectivity—all in a surface‑mount, RoHS‑compliant package.

Request a quote or submit an inquiry to obtain pricing and availability for the 1ST040EH2F35I1VG.