1ST040EH2F35E1VG
| Part Description |
Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 384 31457280 378000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 575 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 384 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | N/A | Number of Logic Elements/Cells | 378000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 31457280 |
Overview of 1ST040EH2F35E1VG – Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 384 31457280 378000 1152-BBGA, FCBGA
The 1ST040EH2F35E1VG is a Stratix® 10 TX field programmable gate array (FPGA) offering a high logic density and large on-chip memory. It provides 378,000 logic elements, 31,457,280 total RAM bits and 384 I/O signals in a 1152-pin ball grid array package.
Specified for surface-mount assembly with an operating temperature range of 0 °C to 100 °C and an extended grade, this device is intended for designs that require substantial programmable logic resources and significant on-chip RAM capacity. The device is RoHS compliant and operates from a voltage supply range of 770 mV to 970 mV.
Key Features
- Core Logic 378,000 logic elements provide a high level of programmable logic resources for complex FPGA implementations.
- On-Chip Memory 31,457,280 total RAM bits enable large embedded data buffers, state storage and memory-intensive logic functions.
- I/O Capacity 384 I/O pins support wide parallel interfaces and extensive external device connectivity.
- Package and Mounting Available in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) and designed for surface-mount assembly.
- Power Supply Voltage supply range of 770 mV to 970 mV allows designs targeting the specified core supply window.
- Temperature and Grade Extended-grade device rated for operation from 0 °C to 100 °C.
- Environmental Compliance RoHS compliant for lead-free assembly and regulatory alignment.
Typical Applications
- High-density FPGA designs Use the device where large numbers of logic elements and substantial on-chip RAM are required to implement complex algorithms or state machines.
- Memory-intensive processing Leverage the 31,457,280 RAM bits for buffering, data staging and large lookup tables within FPGA logic.
- Wide I/O interfacing Employ the 384 I/O pins for systems requiring numerous parallel connections or multi-channel external interfaces.
Unique Advantages
- High logic capacity: 378,000 logic elements provide a large programmable fabric for complex implementations, reducing the need for multiple FPGAs.
- Large on-chip memory: 31,457,280 RAM bits support memory-hungry designs directly on the FPGA, simplifying external memory requirements.
- Extensive I/O resources: 384 I/Os enable broad interfacing options for multi-channel and parallel systems.
- Compact, surface-mount package: 1152-BBGA / 1152-FBGA (35×35) package allows dense PCB integration while preserving high pin count.
- Defined operating range: Extended grade with 0 °C to 100 °C operation and RoHS compliance for consistent supply-chain requirements.
- Controlled supply window: Voltage supply range of 770 mV to 970 mV provides a clear electrical specification for power design.
Why Choose 1ST040EH2F35E1VG?
The 1ST040EH2F35E1VG positions itself as a high-capacity Stratix® 10 TX FPGA option by combining a large logic element count, substantial on-chip RAM and a high I/O count in a single surface-mount package. These characteristics make it appropriate for designs that require consolidated programmable resources and significant on-chip memory without splitting functions across multiple devices.
With an extended temperature grade, RoHS compliance and a clearly defined voltage supply range, the device supports robust design choices where predictable electrical and thermal parameters are required. This part is well suited for engineering teams seeking a scalable FPGA building block with significant logic, memory and I/O integration.
Request a quote or submit an inquiry to obtain pricing and availability for the 1ST040EH2F35E1VG. Technical datasheet and ordering details are available upon request.

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