1ST040EH1F35I1VG

IC FPGA STRATIX10TX 1152FBGA
Part Description

Stratix® 10 TX Field Programmable Gate Array (FPGA) IC 384 31457280 378000 1152-BBGA, FCBGA

Quantity 1,395 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O384Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBsN/ANumber of Logic Elements/Cells378000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits31457280

Overview of 1ST040EH1F35I1VG – Stratix® 10 TX FPGA IC, 378000 logic elements

The 1ST040EH1F35I1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC offering a large programmable fabric and on-chip memory. It provides 378000 logic elements, 31,457,280 total RAM bits, and 384 general-purpose I/O to support complex digital designs.

Packaged in a 1152-BBGA (35×35) surface-mount FCBGA, and rated for industrial operation from -40 °C to 100 °C with a core voltage range of 770 mV to 970 mV, this device is suited for board-level integration where high logic density, significant on-chip RAM, and robust temperature performance are required.

Key Features

  • Core Capacity — 378000 logic elements provide large programmable logic resources for implementing complex functions and custom silicon architectures.
  • On‑Chip Memory — 31,457,280 total RAM bits enable substantial data buffering, state storage, and embedded memory for high‑capacity designs.
  • I/O — 384 I/O pins offer extensive connectivity for interfacing to peripherals, sensors, and external devices.
  • Package — 1152‑FBGA (35×35) FCBGA surface-mount package optimized for compact board integration and high-pin-count needs.
  • Power — Operates from a core supply range of 770 mV to 970 mV, allowing designers to align power budgeting with system requirements.
  • Temperature & Grade — Industrial-grade operation from -40 °C to 100 °C for deployments in demanding thermal environments.
  • Compliance — RoHS compliant.

Unique Advantages

  • High Logic Density: 378000 logic elements support large-scale programmable implementations without immediate need for multiple devices.
  • Large Embedded Memory: 31,457,280 RAM bits reduce dependence on external memory for many control and data‑path functions.
  • Generous I/O Count: 384 I/O pins simplify board-level connectivity and enable parallel interfacing to multiple subsystems.
  • Industrial Temperature Range: Rated from -40 °C to 100 °C for deployments that require extended thermal tolerance.
  • High‑Pin‑Count BGA Package: 1152‑FBGA (35×35) FCBGA package provides compact footprint with the pin count needed for complex designs.
  • RoHS Compliant: Meets RoHS requirements for environmentally conscious designs and manufacturing.

Why Choose 1ST040EH1F35I1VG?

The 1ST040EH1F35I1VG positions itself for designs that demand substantial programmable logic capacity, significant on-chip RAM, and broad I/O connectivity in an industrial‑rated FPGA. Its combination of 378000 logic elements, over 31 million RAM bits, and 384 I/O pins delivers a platform suitable for complex, integrated digital systems where consolidation of functions onto a single device is desirable.

With a compact 1152‑FBGA surface‑mount package and a core voltage range of 770 mV to 970 mV, this device supports board-level integration while maintaining operation across an industrial temperature span. Choose this Stratix® 10 TX FPGA when your design requires high logic density, large embedded memory, and reliable thermal performance.

Request a quote or submit a product inquiry to discuss availability, pricing, and how 1ST040EH1F35I1VG can fit your next design.

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