1ST040EH1F35E2LG

The 1ST040EH1F35E2LG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) by Intel supplied in a 1152-BBGA FCBGA package. It provides a combination of large programmable logic capacity, substantial on-chip memory, and a high I/O count for complex digital designs.

This device is suited for designs that require extensive logic resources and embedded RAM along with broad I/O integration, while operating within a defined core voltage window and an extended operating temperature range.

Key Features

• Logic Capacity 378,000 logic elements to implement complex digital functions and custom architectures.
• On‑chip Memory 31,457,280 total RAM bits for buffering, packet processing, or algorithm state storage.
• I/O Integration 384 I/O pins supporting broad interfacing with peripherals and external devices.
• Power Core voltage supply range of 870 mV to 970 mV to match platform power designs.
• Package and Mounting 1152-FBGA (35×35) supplier device package in a 1152-BBGA, FCBGA case; surface-mount construction.
• Temperature and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• Large programmable capacity: 378,000 logic elements enable implementation of sizable custom logic and parallel processing pipelines.
• Substantial embedded memory: Over 31 million RAM bits for local data storage, queuing, and buffering without external memory dependency.
• High I/O count: 384 I/Os simplify integration with multiple peripherals, high‑speed interfaces, and system-level I/O requirements.
• Compact BGA package: 1152-FBGA (35×35) footprint supports high-density board designs while maintaining a standardized assembly approach.
• Predictable power envelope: Defined core voltage range (870–970 mV) enables consistent power provisioning and design planning.
• Extended operating range & compliance: Extended grade with 0 °C to 100 °C operation and RoHS compliance for regulated environments.

Why Choose 1ST040EH1F35E2LG?

The 1ST040EH1F35E2LG positions itself as a high-capacity FPGA option that combines a large number of logic elements, extensive on‑chip RAM, and a substantial I/O complement in a compact BGA package. Its defined core voltage window and extended temperature range support system designs that require predictable electrical and thermal characteristics.

This device is appropriate for teams and projects needing dense programmable logic and embedded memory within a surface-mount BGA form factor, offering a balance of integration and deployment-ready environmental compliance.

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