1ST040EH1F35E1VG

The 1ST040EH1F35E1VG is a Stratix® 10 TX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152‑BBGA FCBGA package. It provides a combination of high logic capacity, substantial on‑chip RAM, and a large I/O count for complex digital designs.

This device is suited for applications that require significant programmable logic, multi‑megabit on‑chip memory, and a high number of external interfaces while operating within a 0°C to 100°C range and a core supply range of 770 mV to 970 mV.

Key Features

• FPGA Core  Stratix® 10 TX family device implemented as a Field Programmable Gate Array IC with 378,000 logic elements for high‑density logic integration.
• On‑Chip Memory  Total of 31,457,280 bits of RAM available on‑chip to support buffering, frame storage, and memory‑intensive algorithms.
• I/O Capacity  384 user I/O pins to support multiple high‑pin‑count interfaces and parallel signal paths.
• Power Supply  Core voltage supply range of 770 mV to 970 mV to match targeted power domains and board‑level power architectures.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35 × 35 mm) in a surface‑mount form factor for compact board integration.
• Operating Range & Grade  Extended grade device rated for operation from 0°C to 100°C.
• Compliance  RoHS compliant.
• Manufacturer  Intel Stratix® 10 TX family device.

Typical Applications

• High‑density digital processing  Leverage the 378,000 logic elements and large on‑chip RAM to implement complex datapaths and compute pipelines.
• Memory‑intensive algorithms  Use the 31,457,280 bits of RAM for buffering, large FIFO implementations, and algorithmic state storage.
• Multi‑interface systems  The 384 I/O pins support integration of multiple parallel and serial interfaces for high‑channel or multi‑port designs.
• Prototyping and system integration  Surface‑mount 1152‑BBGA package provides a compact, high‑pin‑count platform for prototype and production board layouts.

Unique Advantages

• High logic density: 378,000 logic elements enable implementation of large, partitioned designs without external logic expansion.
• Substantial on‑chip RAM: 31,457,280 bits of RAM reduce reliance on external memory for buffering and scratchpad storage.
• Extensive I/O capability: 384 I/O pins allow for broad connectivity to sensors, transceivers, and peripheral devices.
• Compact, high‑pin‑count package: 1152‑BBGA (35 × 35 mm) provides a balance of density and board‑space efficiency for complex designs.
• Flexible power domain: Core voltage range of 770 mV to 970 mV supports designs targeting modern low‑voltage power architectures.
• Extended operating range and compliance: Rated 0°C to 100°C with RoHS compliance for conformity with lead‑free assembly requirements.

Why Choose 1ST040EH1F35E1VG?

1ST040EH1F35E1VG positions itself as a high‑capacity Stratix® 10 TX FPGA option for designs that demand a large number of logic elements, significant on‑chip RAM, and substantial I/O in a compact surface‑mount package. Its extended temperature range and defined core voltage window make it suitable for many standard embedded and high‑complexity FPGA applications.

Backed by Intel’s Stratix® 10 TX family, this device is appropriate for designers and teams building dense, memory‑centric, multi‑interface systems who require a scalable programmable logic solution with a high I/O count and on‑chip memory resources.

Request a quote or contact sales to discuss pricing, lead times, and how 1ST040EH1F35E1VG can fit into your next design.