1SG280LU3F50I3XG

The 1SG280LU3F50I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package designed for high-performance, industrial-grade applications. It combines the Stratix 10 family architecture with a large logic and memory footprint to address demanding bandwidth and processing requirements.

Targeted at applications requiring high logic density, extensive on-chip RAM, and flexible I/O, this device delivers the integration and thermal range needed for robust industrial use. Family-level innovations such as the Intel Hyperflex core architecture and advanced transceiver technology are included in the Stratix 10 GX/SX device overview.

Key Features

• Core architecture Intel Stratix 10 family capabilities including the Intel Hyperflex™ core architecture for increased core performance as described in the Stratix 10 device overview.
• Logic capacity 2,800,000 logic elements, providing substantial fabric resources for large, complex FPGA designs.
• On-chip memory 240,123,904 total RAM bits available on-chip for buffering, packet processing, and large datasets.
• I/O and package 704 I/Os in a surface-mount 2397-BBGA (FCBGA) package; supplier device package listed as 2397-FBGA, FC (50×50).
• Supply voltage Core voltage range of 820 mV to 880 mV for device operation.
• Operating range and grade Industrial-grade device rated for operation from −40 °C to 100 °C.
• High-speed transceiver capability (family-level) Stratix 10 family-level transceiver features include data rates up to 28.3 Gbps and up to 96 full-duplex transceiver channels on heterogeneous 3D SiP transceiver tiles, as detailed in the family overview.
• Family-level system features Stratix 10 family highlights in the device overview include FinFET process technology, fractional synthesis PLLs, hard IP such as PCI Express and 10G Ethernet, variable-precision DSP blocks, and advanced configuration/security features.
• Compliance RoHS compliant.

Typical Applications

• High-bandwidth networking and switching Use the device’s large logic and memory resources plus Stratix 10 family transceiver capabilities for packet processing, line-rate switching, and network appliances.
• Data center acceleration Implement PCI Express-based acceleration and custom datapath engines using the device’s extensive logic capacity and on-chip RAM.
• Telecommunications and backplane systems Leverage family-level high-speed transceivers and backplane performance for transport, aggregation, and optical interfaces.
• High-performance signal processing Deploy variable-precision DSP blocks and large on-chip memory for real-time signal processing, modulation/demodulation, and compute-intensive algorithms.

Unique Advantages

• High logic density: 2.8 million logic elements enable large-scale integration and complex FPGA implementations within a single device.
• Large on-chip memory: 240,123,904 bits of RAM reduce external memory dependency and improve data throughput and latency.
• Extensive I/O in a compact package: 704 I/Os in a 2397-BBGA FCBGA package provide flexible interfacing while supporting surface-mount PCB assembly.
• Industrial temperature range: Rated for −40 °C to 100 °C to meet the thermal demands of industrial systems.
• Stratix 10 family innovations: Access to family-level features such as Hyperflex core architecture, high-speed transceivers, and hard IP building blocks as described in the device overview.
• Regulatory compliance: RoHS compliance supports environmental regulatory requirements.

Why Choose 1SG280LU3F50I3XG?

The 1SG280LU3F50I3XG positions itself as a high-capacity, industrial-grade Stratix 10 GX FPGA suited for designs that require a combination of extensive logic fabric, large on-chip memory, and substantial I/O. Its package and thermal rating make it suitable for demanding embedded and infrastructure applications where reliability and integration density are important.

Backed by the Stratix 10 family overview, this device brings family-level architecture and transceiver capabilities into a form factor and specification set appropriate for engineers building high-bandwidth networking, acceleration, and signal-processing solutions. Its combination of resources helps reduce external component count and supports scalable, long-life designs.

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