1SG280LU3F50I2VGAS

The 1SG280LU3F50I2VGAS is an Intel Stratix® 10 GX FPGA optimized for high-bandwidth, processing‑intensive designs. As part of the Stratix 10 GX family, the device leverages the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) technology to address demanding FPGA applications.

This industrial‑grade, surface‑mount FPGA provides a combination of large logic capacity, extensive on‑chip RAM and high I/O/transceiver density for systems that require scalable programmable logic, advanced interface support and robust configuration and security capabilities.

Key Features

• Core & Architecture  Built on the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) process for improved core performance and power efficiency across the Stratix 10 GX family.
• Logic Capacity  Approximately 2,800,000 logic elements and 350,000 logic blocks to implement large, complex hardware designs and partitioned functions.
• On‑Chip Memory  240,123,904 total RAM bits of embedded memory for buffering, packet processing, and deep pipeline storage requirements.
• I/O and Transceiver Capability  704 general‑purpose I/Os and family‑level high‑speed serial transceiver capabilities (family transceiver performance up to 28.3 Gbps and multi‑channel support) for high‑bandwidth interfaces and packet I/O.
• Hard IP and DSP  Family features include hard PCI Express Gen3, 10G Ethernet and high‑efficiency variable precision DSP blocks to accelerate common protocol and signal‑processing tasks.
• Power and Voltage  Core supply operating range of 770 mV to 970 mV to support low‑voltage operation and power management strategies.
• Package & Mounting  Surface‑mount package in 2397‑BBGA, FCBGA format (supplier package: 2397‑FBGA, FC (50x50)) for high‑density board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Configuration, Security & Reliability  Family documentation details secure device management, partial and dynamic reconfiguration capabilities, and SEU error detection and correction features to support resilient, field‑upgradable systems.
• Regulatory  RoHS compliant.

Typical Applications

• High‑Performance Networking & Switching  Use the device’s large logic and on‑chip RAM to implement packet processing, traffic management and line‑rate switching functions.
• Telecommunications & Optical Transport  High‑speed transceiver capability and protocol hard IP make the device suitable for backplane and module interfaces in telecom systems.
• Data Center Acceleration  Implement custom accelerators and protocol offloads where large programmable logic capacity and DSP resources reduce latency and increase throughput.
• Test, Measurement & Instrumentation  Combine high I/O density and embedded memory to handle wideband data capture, preprocessing and interfacing for measurement systems.

Unique Advantages

• Massive Logic Scale: 2.8 million logic elements enable integration of multiple complex subsystems on a single device, reducing BOM and interconnect complexity.
• Significant On‑Chip Memory: 240+ million RAM bits provide headroom for deep buffering, lookup tables and large state machines without external memory.
• High I/O and High‑Speed Links: 704 I/Os combined with family transceiver performance support dense front‑end connectivity and multi‑lane, multi‑protocol interfaces.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports reliable deployment in industrial and ruggedized systems.
• Secure, Flexible Configuration: Family features for secure device management, partial/dynamic reconfiguration and SEU mitigation simplify field updates and enhance system uptime.
• Package Density: 2397‑BBGA/FCBGA package (50x50) enables compact board area for high‑density system designs.

Why Choose 1SG280LU3F50I2VGAS?

The 1SG280LU3F50I2VGAS delivers the performance and integration expected from the Stratix 10 GX family: a large logic fabric, abundant embedded memory, extensive I/O and high‑speed serial capability, all in an industrial‑rated, surface‑mount package. It is suited for engineering teams building high‑bandwidth, compute‑intensive and interface‑dense systems where consolidation of functions into a single FPGA reduces board complexity and accelerates time to market.

Supported by Stratix 10 family architecture and configuration/security features, this device provides long‑term value for scalable designs that require robust programmability, hardware acceleration and dependable operation across industrial temperature ranges.

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