1SG280LU3F50I3VP

The Intel Stratix® 10 GX 1SG280LU3F50I3VP is a high-performance field programmable gate array (FPGA) featuring 2,800,000 logic elements and a large on-chip RAM of 240,123,904 bits. Built on the Stratix 10 family architecture, this device targets advanced, high-bandwidth applications that require significant logic capacity, large embedded memory, and flexible I/O connectivity.

As part of the Stratix 10 GX series, the device leverages family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate process to deliver improved core performance and power efficiency for compute- and I/O-intensive systems.

Key Features

• Logic Capacity  2,800,000 logic elements provide extensive fabric resources for large FPGA designs and complex algorithms.
• On-chip Memory  240,123,904 total RAM bits for buffering, packet processing, and data-path storage without immediate external memory dependence.
• I/O Density  704 user I/O pins to support wide parallel interfaces, multi-channel data paths, and extensive peripheral connectivity.
• Advanced Core Architecture  Implements the Intel Hyperflex™ core architecture (Stratix 10 family innovation) and Intel 14 nm tri-gate process for improved core performance and efficiency.
• Transceiver & Interface Support (Family)  Stratix 10 GX family-level transceiver technology and hard IP (as described in the device family overview) enable high-speed serial connectivity and protocol support in advanced system designs.
• Power Supply  Operates from a core supply range of 770 mV to 970 mV for the device core.
• Package & Mounting  2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC, 50×50) with surface-mount mounting for compact board integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Large logic capacity and high I/O count suit packet processing, line cards, and switch fabric implementations that demand on‑chip buffering and complex processing.
• Telecommunications & Backplane Systems  Stratix 10 GX family transceiver and hard-IP capabilities (described in the device family overview) enable high-speed serial links and protocol integration for backplane and optical interfaces.
• Data Center Acceleration  Extensive logic and memory resources support compute offload, data-path acceleration, and custom processing engines deployed in servers and accelerators.
• Test & Measurement  High I/O density and large on-chip RAM enable real-time data capture, preprocessing, and custom instrumentation logic for measurement systems.

Unique Advantages

• Massive Logic & Memory  2.8M logic elements combined with 240M+ RAM bits let you consolidate complex subsystems onto a single device, reducing system BOM and board area.
• High I/O Count  704 I/O pins provide the interface flexibility needed for multi-lane data paths, wide buses, and dense peripheral integration.
• Family-Level Performance Innovations  Built on the Stratix 10 family innovations—including the Intel Hyperflex core architecture and 14 nm tri-gate process—to deliver improved core performance and efficiency compared with prior architectures.
• Industrial Temperature Range  Rated −40 °C to 100 °C for deployment where extended ambient ranges are required.
• Compact, High‑Pin Package  2397‑BBGA/FBGA package provides high pin count and compact footprint for dense system designs.
• Regulatory & Assembly Friendly  Surface-mount package and RoHS compliance support standard manufacturing processes and environmental requirements.

Why Choose 1SG280LU3F50I3VP?

The 1SG280LU3F50I3VP delivers substantial programmable logic, large on-chip RAM, and a high I/O count packaged in a dense 2397-BBGA surface-mount form factor. It is positioned for advanced designs that require high logic capacity, significant memory bandwidth on-chip, and robust interface capability under industrial temperature conditions.

Designers targeting networking, telecom, data center acceleration, or sophisticated test systems will find this Stratix 10 GX device suited to consolidating functionality, reducing external component needs, and implementing high-throughput processing pipelines while leveraging the Stratix 10 family architectural improvements.

Request a quote or submit an inquiry for pricing and availability to get detailed lead‑time and ordering information for the 1SG280LU3F50I3VP.