1SG280LU3F50E3VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 704 2800000 2397-BBGA, FCBGA |
|---|---|
| Quantity | 122 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2397-FBGA, FC (50x50) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2397-BBGA, FCBGA | Number of I/O | 704 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LU3F50E3VGAS – Stratix® 10 GX FPGA, 2,800,000 Logic Elements, 704 I/O, 2397‑FBGA
The 1SG280LU3F50E3VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 2397‑FBGA (50×50) body and offered in an extended grade. It delivers 2,800,000 logic elements and abundant on‑chip memory, targeting high‑bandwidth, high‑performance applications that require large logic capacity, heavy DSP processing and extensive I/O.
Built on the Stratix 10 family architecture, the device leverages the Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology to deliver significant core performance and power advantages for demanding networking, compute acceleration and communications designs.
Key Features
- High Logic Capacity — 2,800,000 logic elements to implement large custom logic and complex algorithms.
- On‑chip Memory — 240,123,904 total RAM bits for buffering, packet processing and memory‑intensive functions.
- Extensive I/O — 704 I/O pins to support wide parallel interfaces and a variety of external connections.
- Advanced Core Architecture — Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology for improved core performance and energy efficiency relative to previous generations.
- Transceiver and High‑Speed Capability (Family‑Level) — Stratix 10 family features include heterogeneous 3D SiP transceiver tiles and transceiver data rates described in the family overview, enabling high‑bandwidth chip‑to‑chip and backplane links.
- DSP and Compute (Family‑Level) — Family documentation highlights variable precision DSP blocks and high compute capability suited for signal processing and acceleration tasks.
- Package and Mounting — 2397‑FBGA, FC (50×50) package; surface mount assembly.
- Power and Supply — Supported core voltage range from 770 mV to 970 mV.
- Operating Range and Grade — Rated for 0 °C to 100 °C operation; grade: Extended.
- Compliance — RoHS compliant.
Typical Applications
- High‑Performance Networking — Use the large logic capacity and on‑chip memory for packet processing, forwarding engines and protocol offload in switches and routers.
- Data Center Acceleration — Apply the device’s compute‑oriented architecture and DSP resources for hardware accelerators, compression, and encryption/DEcryption tasks.
- Telecommunications and Backplane Systems — Leverage family transceiver capabilities and abundant I/O for high‑speed links, PHY interfacing and custom protocol implementation.
- Test, Measurement and Prototyping — Deploy the FPGA for signal acquisition, processing pipelines and hardware emulation where large logic and memory resources are required.
Unique Advantages
- Large, Integrated Logic Resource: 2.8 million logic elements enable implementation of complex system logic without extensive external components.
- Significant On‑Chip Memory: 240,123,904 RAM bits reduce dependence on external memory for buffering and real‑time data handling.
- Extensive I/O Density: 704 I/O pins support wide parallel buses and multiple simultaneous interfaces to peripherals and transceivers.
- Modern Process and Core Architecture: Hyperflex architecture on 14 nm FinFET process provides improved core performance and power efficiency as described in the Stratix 10 family overview.
- Production‑Ready Package and Grade: 2397‑FBGA (50×50) surface‑mount package and Extended grade support deployment in demanding commercial and enterprise environments.
- Standards‑Oriented Family Features: The Stratix 10 family includes high‑speed transceiver and DSP capabilities useful for designs requiring advanced connectivity and signal processing.
Why Choose 1SG280LU3F50E3VGAS?
This Stratix 10 GX device positions itself for designs that demand a combination of very high logic density, substantial on‑chip memory and extensive I/O. Its foundation in the Hyperflex architecture and 14 nm FinFET process—documented for the Stratix 10 family—aligns the part with high‑bandwidth networking, compute acceleration and communications applications.
Engineers and procurement teams selecting 1SG280LU3F50E3VGAS gain a scalable FPGA platform with the logic, memory and I/O required to consolidate functions, reduce external component count and accelerate time to prototype and production. The Extended grade and RoHS compliance support integration into enterprise‑class systems.
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