1SG280LU3F50E2LGS3

The 1SG280LU3F50E2LGS3 is an Intel Stratix® 10 GX family FPGA supplied in a 2397-BBGA FCBGA surface-mount package. It combines the Stratix 10 family’s Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process innovations to deliver significant core performance and power efficiency improvements.

Targeted for advanced applications that demand high bandwidth and compute density, this extended-grade device provides a large logic fabric, deep embedded SRAM, substantial I/O capacity, and a low-voltage core supply suitable for high-performance system designs.

Key Features

• Core & Architecture  Intel Hyperflex™ core architecture implemented in 14 nm tri-gate (FinFET) technology; family-level performance improvements include up to 2× core performance and up to 70% lower power versus prior-generation high-performance FPGAs.
• Logic Capacity  Approximately 2,800,000 logic elements providing a very large programmable fabric for complex logic, acceleration, and custom datapath implementations.
• Embedded Memory  Total on-chip RAM of 240,123,904 bits to support large buffering, scratchpad storage, and memory-intensive designs.
• I/O and Package  704 device I/O in a 2397-BBGA FCBGA package (supplier device package listed as 2397-FBGA, FC 50×50); surface-mount mounting type for compact board-level integration.
• High-speed SerDes and Protocol IP (Family-Level)  Stratix 10 family features include heterogeneous 3D SiP transceiver tiles, up to 96 full-duplex transceiver channels and transceiver data rates up to 28.3 Gbps, plus hard IP such as PCI Express Gen3 x16 and 10G Ethernet FEC functionality.
• DSP and Compute (Family-Level)  Variable-precision DSP blocks and family-level DSP compute capabilities support high-throughput signal processing and compute acceleration needs.
• Power and Voltage  Core voltage supply range specified at 820 mV to 880 mV to match low-voltage core domains used in Stratix 10 devices.
• Grade and Temperature  Extended-grade device with an operating temperature range of 0 °C to 100 °C for use in a range of commercial and industrial-adjacent environments.
• Compliance  RoHS compliant.

Typical Applications

• High-speed Networking  Use for packet processing, switch/router line cards, and network aggregation where high I/O counts and high-speed transceivers are required.
• Data Center Acceleration  Suitable for compute acceleration, custom offload engines, and protocol processing that benefit from large logic capacity and abundant embedded memory.
• Telecommunications  Deploy in transport and aggregation equipment that leverage high-speed SerDes channels and forward error correction features available in the Stratix 10 family.
• High-Performance Signal Processing  Implement large DSP pipelines and multi-channel processing tasks using the device’s extensive logic fabric and on-chip RAM.

Unique Advantages

• Massive Logic Scale: Approximately 2,800,000 logic elements enable integration of complex algorithms, large custom accelerators, and multi-function systems on a single device.
• Large On-Chip Memory: 240,123,904 total RAM bits reduce external memory dependence and simplify high-bandwidth buffering and storage needs.
• High I/O Density: 704 device I/O in a high-density 2397-BBGA package supports complex board-level routing and multiple high-speed interfaces.
• Family-Level High-Speed SerDes and Protocol IP: Stratix 10 family features such as up to 28.3 Gbps transceiver data rates and hard PCIe Gen3/10G Ethernet IP accelerate system-level design and reduce integration risk.
• Low-Voltage Core: 820 mV–880 mV supply range aligns with low-power core domains used in modern high-performance FPGAs.
• Extended Operating Range: 0 °C to 100 °C extended-grade rating suits applications requiring broader-than-standard commercial temperature support.

Why Choose 1SG280LU3F50E2LGS3?

As a member of the Intel Stratix 10 GX family, the 1SG280LU3F50E2LGS3 delivers a combination of very large logic capacity, substantial embedded memory, and high I/O density in a compact 2397-BBGA package. The device leverages family-level architectural innovations such as the Hyperflex core and 14 nm tri-gate process to provide measurable core-performance and power-efficiency gains compared to earlier high-performance FPGAs.

This device is well suited for engineers designing high-bandwidth networking, data-center acceleration, telecommunications, and advanced signal-processing systems that require scalable logic resources, plentiful on-chip RAM, and support for high-speed serial interfaces.

Request a quote or submit an inquiry to receive pricing and availability for the 1SG280LU3F50E2LGS3 and to discuss how this Stratix 10 GX FPGA can fit into your next high-performance design.