1SG280LU2F50E2VGS3

The Intel Stratix® 10 GX device 1SG280LU2F50E2VGS3 is a high-density FPGA built on Intel’s Stratix 10 GX family and Hyperflex core architecture. This surface-mount, extended-grade FPGA addresses demanding compute and connectivity roles by combining millions of logic elements, large on-chip RAM, and broad I/O capability.

Designed for applications that require high logic capacity, significant embedded memory, and high-speed serial connectivity, this device delivers integration and performance suitable for advanced networking, high-performance compute acceleration, and data-plane processing.

Key Features

• Core Architecture: Intel Hyperflex core architecture implemented on Stratix 10 GX family technology, delivering the architectural benefits described for the device family.
• Logic Capacity: 2,800,000 logic elements, enabling complex FPGA implementations and high-density designs.
• On-Chip Memory: 240,123,904 total RAM bits of embedded memory to support large buffers and stateful processing on-chip.
• I/O and Connectivity: 704 user I/O pins and family transceiver technology with high-speed capabilities, suitable for dense external interfacing and high-bandwidth serial links.
• Transceiver and PHY Technology: Family-level support for heterogeneous 3D SiP transceiver tiles and transceiver data rates referenced in the device family documentation (family overview lists multi-gigabit transceiver capabilities).
• Power Supply Range: Core voltage supply between 770 mV and 970 mV to match system power designs and regulator selections.
• Package and Mounting: 2397-BBGA (FCBGA) package; supplier package listed as 2397-FBGA, FC (50×50). Surface mount device simplifies board-level assembly.
• Operating Temperature and Grade: Extended grade with an operating temperature range of 0°C to 100°C for use in temperature-controlled environments.
• Standards and Compliance: RoHS compliant material and manufacturing status.

Typical Applications

• High‑Speed Networking: Implements packet processing, switch/router fabric, and line-rate protocol logic using large logic capacity and high-speed transceiver technology.
• Data Center Acceleration: Offloads compute- and memory-intensive workloads with large on-chip RAM and dense logic for custom acceleration engines and data-path processing.
• Telecommunications Infrastructure: Supports backplane and module-level high-bandwidth links and complex protocol implementations enabled by the device family’s transceiver and PHY features.
• Test & Measurement: Enables high-channel-count signal processing and real-time data aggregation leveraging abundant logic elements and embedded memory resources.

Unique Advantages

• High Logic Density: 2.8 million logic elements provide headroom for large, complex designs and multi-function implementations on a single device.
• Large On‑Chip Memory: 240,123,904 bits of embedded RAM reduce external memory dependence for buffering and low-latency data handling.
• Broad I/O Count: 704 I/O pins give flexible interface options for parallel buses, control signals, and high-density board routing.
• Family-Level High‑Speed Transceivers: Stratix 10 GX family transceiver technologies provide the serial connectivity options referenced in the device documentation for high-bandwidth links.
• Surface Mount, High‑Density Package: 2397-BBGA (FCBGA) package supports compact board layouts while enabling extensive I/O and routing resources.
• Extended Grade and RoHS Compliance: Extended-grade device rating and RoHS compliance align with commercial and controlled-environment deployments.

Why Choose 1SG280LU2F50E2VGS3?

1SG280LU2F50E2VGS3 positions itself as a high-capacity Stratix 10 GX FPGA suitable for designs that require a combination of large logic resources, substantial on-chip RAM, and extensive I/O. Its Hyperflex-based family architecture and Stratix 10 family features provide the platform characteristics needed for advanced networking, acceleration, and complex signal-processing applications.

For engineering teams targeting scalable, high-performance FPGA-based solutions, this extended-grade Stratix 10 GX device delivers the raw resources and package density to consolidate functionality, reduce external components, and accelerate system-level development.

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