1SG280LN3F43I3XGAS

The Intel Stratix® 10 GX 1SG280LN3F43I3XGAS is a high-density Field Programmable Gate Array (FPGA) in a 1760-BBGA (42.5 × 42.5 mm) package. It delivers 2,800,000 logic elements and a large on-chip RAM resource of 240,123,904 bits, suitable for advanced, compute- and I/O-intensive applications.

Built on the Stratix 10 family architecture, the device offers the family’s innovations — including the Hyperflex core architecture and high-speed transceiver and hard IP capabilities described in the device overview — enabling designers to address demanding bandwidth and processing requirements while operating across an industrial temperature range.

Key Features

• Logic Capacity  2,800,000 logic elements (cells) for implementing large, complex FPGA designs.
• On‑Chip Memory  240,123,904 total RAM bits to support buffering, packet processing, and large lookup tables.
• I/O Density  688 user I/O pins to support extensive interfacing and parallel connectivity.
• Package & Mounting  1760-BBGA, FCBGA supplier package (1760-FBGA, 42.5 × 42.5 mm) and surface-mount assembly.
• Power Supply  Core voltage supply window of 820 mV to 880 mV to match targeted power domains and board-level power delivery.
• Temperature Range  Industrial operating temperature from -40 °C to 100 °C for use in extended-environment designs.
• Family Innovations (Stratix 10)  Family-level features in the datasheet include the Intel Hyperflex core architecture, 14 nm tri-gate process technology, high-speed transceivers, hard PCI Express and 10G Ethernet IP, and variable-precision DSP blocks suitable for high-performance signal processing.
• Compliance  RoHS compliant.

Typical Applications

• High‑Bandwidth Networking & Communications  Use the device’s logic density, large on-chip RAM, and family transceiver/IP capabilities for packet processing, aggregation, and line-rate traffic handling.
• Data Center Acceleration  Implement custom acceleration kernels and offload functions that require high logic capacity and significant memory resources.
• Telecom & Infrastructure  Deploy in systems that require extensive I/O and industrial temperature operation for long-life network equipment.
• Advanced Signal Processing  Leverage the family’s DSP and memory resources for compute-heavy tasks such as filtering, encoding, and complex data path implementations.

Unique Advantages

• Very high logic density: 2.8 million logic elements allow large designs and multi-function integration on a single device, reducing board-level complexity.
• Substantial on-chip memory: 240M+ bits of RAM enable deep buffering and complex state machines without immediate reliance on external memory.
• Extensive I/O resources: 688 I/Os support broad peripheral connectivity and parallel interfaces for demanding system-level integration.
• Industrial temperature operation: Rated for -40 °C to 100 °C to support deployment in environmentally challenging installations.
• Compact, high‑pin‑count package: The 1760-BBGA package provides dense routing and interconnect capability in a single surface-mount component.
• Family-level high-performance features: Benefits from Stratix 10 family innovations such as Hyperflex architecture, high-speed transceiver and hard-IP building blocks for PCIe and Ethernet as described in the device overview.

Why Choose 1SG280LN3F43I3XGAS?

This Stratix® 10 GX device targets designers who need large FPGA fabric, significant on-chip memory, and high I/O counts in an industrial-temperature, surface-mount package. The combination of 2,800,000 logic elements and 240,123,904 bits of RAM makes it well-suited to complex, high-throughput designs where integration and on-board resource density reduce system complexity.

Choosing this part provides access to the Stratix 10 family’s performance and architectural advantages documented in the device overview, giving a clear upgrade path for projects that demand scalable logic, advanced connectivity, and robust thermal range for long-term deployments.

Request a quote or submit an inquiry to evaluate how 1SG280LN3F43I3XGAS fits your next high-performance FPGA design and procurement plan.