1SG280LN3F43I2LP

The 1SG280LN3F43I2LP is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) supplied in a 1760-BBGA (1760-FBGA 42.5×42.5) package for surface-mount assembly. It combines a large programmable fabric with high I/O density and on-chip memory to address advanced applications that require high processing throughput and extensive logic integration.

Built on the Stratix 10 GX family architecture, this device targets high-performance applications where performance per watt, integration and scalable logic capacity are key considerations.

Key Features

• Core Architecture  Stratix 10 GX family architecture with Intel Hyperflex™ core innovations documented for the device family.
• Large Logic Capacity  2,800,000 logic elements provide extensive programmable fabric for complex designs and large-scale integration.
• On‑Chip Memory  240,123,904 total RAM bits for buffering, LUTRAM and embedded data storage across the design.
• High I/O Count  688 I/O pins support dense external connectivity and multi-channel interfaces.
• Package & Mounting  1760-BBGA, FCBGA package (supplier device package: 1760-FBGA (42.5×42.5)) with surface-mount mounting type for high-pin-count board implementations.
• Power  Core voltage supply range 820 mV to 880 mV for the device core.
• Operating Range  Industrial-grade operating temperature from -40 °C to 100 °C suitable for a wide range of deployed systems.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Performance Compute Acceleration  Large logic capacity and substantial on-chip memory enable hardware acceleration of compute-intensive kernels and custom datapaths.
• Network and Telecom Infrastructure  High I/O density and family-level transceiver and networking features support packet processing, backplane and switch fabric designs.
• Data Center and Storage  Programmable fabric and memory resources allow implementation of custom storage controllers, compression, and I/O offload functions.
• Signal Processing  Large RAM and logic resources suit DSP-heavy workloads such as filtering, FFTs and real-time processing pipelines.

Unique Advantages

• Extensive Programmable Fabric:  2.8 million logic elements provide headroom for complex, high-density designs and multiple IP blocks on a single device.
• Substantial On‑Chip Memory:  240,123,904 total RAM bits reduce dependency on external memory for many buffering and state storage needs.
• High I/O Integration:  688 I/O pins enable numerous parallel interfaces and high channel counts without external multiplexing.
• Industrial Temperature Range:  Rated from -40 °C to 100 °C for deployment in demanding environmental conditions.
• Compact, High‑Pin Package:  1760‑FBGA (42.5×42.5) balances high I/O and thermal considerations in a single, manufacturable package.
• Controlled Core Power Range:  820–880 mV core supply specification supports predictable power planning and system power delivery design.

Why Choose 1SG280LN3F43I2LP?

This Stratix 10 GX FPGA part combines a very large logic fabric with ample on-chip memory and extensive I/O, making it well suited for designers building high-throughput, integration-dense systems. Its industrial temperature rating and RoHS compliance make it appropriate for production deployments across communications, data center, and signal processing applications.

For teams needing scalability, predictable power characteristics, and a high I/O count in a single device, the 1SG280LN3F43I2LP offers the capacity and package density to consolidate functions and simplify board-level design.

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