1SG280LN3F43I3XG

The 1SG280LN3F43I3XG is an Intel Stratix® 10 GX field programmable gate array in a 1760‑BBGA (FCBGA) package. It leverages the Intel Stratix 10 family innovations, including the Intel Hyperflex™ core architecture and Intel 14 nm tri‑gate (FinFET) process, to address high‑performance, bandwidth‑intensive designs.

With 2,800,000 logic elements, 240,123,904 bits of on‑chip RAM and 688 user I/Os, this device targets advanced communications, data‑center acceleration and compute‑intensive signal processing applications that require large programmable fabric, high I/O density and extended operating range.

Key Features

• Core architecture  Built on the Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) technology as described for the Stratix 10 family, enabling higher core performance and power efficiency relative to previous generation devices.
• Logic capacity  2,800,000 logic elements provide large programmable fabric for complex logic, control and data‑path implementations.
• On‑chip memory  240,123,904 total RAM bits of internal SRAM to support large buffering, lookup tables and memory‑centric designs.
• I/O and package  688 user I/Os in a surface‑mount 1760‑BBGA (FCBGA) package, supplier package 1760‑FBGA (42.5 × 42.5 mm), for high‑density board integration.
• Power domain  Core voltage supply range 820 mV to 880 mV, enabling designs that target the specified low‑voltage core operation.
• Thermal and grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for deployment in extended temperature environments.
• Family‑level high‑speed I/O and IP  Stratix 10 family innovations include heterogeneous 3D SiP transceiver tiles, up to 96 full‑duplex transceiver channels with multi‑Gbps data rates, hard PCI Express® Gen3 x16 IP blocks, hard 10GBASE‑KR/40GBASE‑KR4 FEC in transceiver channels, and hard memory controllers supporting DDR4 up to 2666 Mbps per pin.
• Regulatory  RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• High‑speed networking  Use the device’s high I/O count, on‑chip RAM and Stratix 10 family transceiver/IP options for packet processing, line cards and switch/router functions.
• Data‑center acceleration  Large logic and memory capacity support custom accelerators, packet inspection and protocol offload functions in data‑center environments.
• Signal processing and compute  High logic density and abundant internal RAM enable implementation of DSP pipelines, real‑time analytics and large parallel compute kernels.
• Backplane and optical interfaces  Family‑level transceiver capabilities and hard FEC/PHY IP support high‑speed backplane and optical link implementations.

Unique Advantages

• Large programmable fabric: 2,800,000 logic elements allow complex system integration and consolidation of multiple functions on a single device.
• Substantial on‑chip memory: 240,123,904 bits of RAM reduce external memory dependence and improve latency for buffering and lookup operations.
• High I/O density in a compact package: 688 I/Os in a 1760‑BBGA FCBGA (42.5 × 42.5 mm supplier package) simplifies routing for high‑pin‑count systems.
• Industrial temperature capability: −40 °C to 100 °C operation supports deployment in environments requiring extended temperature range.
• Family innovations available: Access to Stratix 10 family technologies such as Hyperflex core architecture, heterogeneous transceiver tiles and hard IP (PCIe, Ethernet FEC, DDR4 PHY) to accelerate system implementation.
• RoHS compliance: Conforms to RoHS requirements for reduced hazardous substances.

Why Choose 1SG280LN3F43I3XG?

The 1SG280LN3F43I3XG combines a very large logic element count, extensive on‑chip RAM and a high I/O complement in a high‑density FCBGA package, making it suitable for demanding, bandwidth‑oriented designs. Its affiliation with the Stratix 10 GX family means designers can leverage family‑level performance and IP building blocks to accelerate development.

This device is positioned for engineers and procurement teams developing advanced communications, compute acceleration and high‑performance signal processing systems that require scalable programmable logic, integrated memory resources and extended operating temperature support.

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