1SG280LN3F43I3VGAS

The 1SG280LN3F43I3VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) supplied in a 1760-ball FCBGA package. It couples a large programmable fabric with extensive on‑chip RAM and high I/O density to support advanced, high‑performance designs.

Designed for demanding industrial applications, this device leverages Intel Stratix 10 family innovations—such as the Hyperflex core architecture and Intel 14 nm tri‑gate process—to deliver scalable logic capacity, high memory bandwidth, and robust I/O for next‑generation communications, compute and accelerator systems.

Key Features

• Logic Capacity — 2,800,000 logic elements, enabling complex, high‑density designs and extensive custom logic integration.
• On‑chip Memory — 240,123,904 total RAM bits for large buffering, packet processing, and data‑intensive algorithms without immediate external memory dependency.
• I/O Density — 688 user I/O pins to support wide parallel interfaces, high‑port counts, and flexible board routing options.
• Power and Core Voltage — Core voltage supply range 770 mV to 970 mV, suitable for precision power delivery and tuning within the specified range.
• Package and Mounting — 1760‑BBGA (FCBGA) surface‑mount package; supplier package listed as 1760‑FBGA (42.5 × 42.5 mm) for high‑density PCB implementations.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C, addressing industrial thermal requirements.
• Family Innovations — Built on Stratix 10 GX family technologies such as the Intel Hyperflex core architecture, 14 nm tri‑gate (FinFET) process, and heterogeneous 3D SiP transceiver tiles as documented for the Stratix 10 family.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High‑Performance Networking and Switching — Use the device’s large logic array and high I/O count to implement packet processing, custom switching fabrics, and protocol offload engines.
• Data Center Acceleration — Leverage the significant on‑chip RAM and logic capacity for hardware acceleration tasks, inline processing, and workload offload in compute nodes.
• High‑Speed Communications Equipment — Combine the Stratix 10 family transceiver and fabric innovations with this device’s I/O density for backplane, linecard, and module designs.
• Advanced DSP and Signal Processing — Large logic resources and RAM enable complex DSP pipelines, filtering, and real‑time processing in instrumentation and communications systems.

Unique Advantages

• Exceptional Logic Scale: 2.8 million logic elements provide headroom for large, multi‑function designs and extensive customization.
• Substantial On‑Chip Memory: 240+ million bits of RAM reduce external memory dependency and simplify memory architecture for latency‑sensitive applications.
• High I/O Count: 688 I/Os support broad interface connectivity and parallel data paths, simplifying system integration.
• Industrial Reliability: −40°C to 100°C operating range and RoHS compliance support deployment in industrial environments.
• Proven Family Technology: Built on documented Stratix 10 GX family features—such as the Hyperflex core and 14 nm FinFET process—providing a clear technological roadmap.
• Compact High‑Density Package: 1760‑ball FCBGA (42.5 × 42.5 mm) enables high‑performance designs in a compact board footprint.

Why Choose 1SG280LN3F43I3VGAS?

The 1SG280LN3F43I3VGAS positions itself for engineers who require significant programmable logic capacity, large on‑chip memory, and a high pin count in an industrial‑grade FPGA. Its combination of 2.8 million logic elements, extensive RAM, and 688 I/Os makes it suitable for complex networking, acceleration, and high‑throughput signal processing systems where integration and performance are key.

Choosing this Stratix 10 GX device aligns designs with the Stratix 10 family’s architectural advances and manufacturing process, offering a path to scalable, high‑performance implementations with industrial thermal tolerance and RoHS compliance.

Request a quote or submit a pricing inquiry to evaluate 1SG280LN3F43I3VGAS for your next high‑performance FPGA design.