1SG280LN3F43I2LGAS

The 1SG280LN3F43I2LGAS is an Intel Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package, designed for high-performance, programmable hardware implementations. Built around the Stratix 10 family architecture, it targets bandwidth- and compute-intensive applications where core performance, advanced I/O and large on-chip memory are important design drivers.

Key value comes from family-level architectural innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate process, delivering improved core performance and power efficiency for demanding systems. This device integrates a large logic capacity, extensive I/O and substantial on-chip RAM to support complex processing, networking and signal-processing workloads.

Key Features

• Logic Capacity — 2,800,000 logic elements to implement large, high-density designs and complex custom logic.
• On-Chip Memory — 240,123,904 total RAM bits for buffering, packet processing and algorithmic memory needs.
• I/O — 688 I/O pins to support extensive external interfacing and high-pin-count system designs.
• Package — 1760-BBGA, FCBGA (supplier package: 1760-FBGA, 42.5×42.5 mm) optimized for high-pin-count, high-performance board layouts.
• Power Supply — Core voltage range 820 mV to 880 mV for device operation.
• Operating Range — Industrial temperature grade: −40 °C to 100 °C suitable for industrial environments.
• Mounting — Surface mount package for standard PCB assembly processes.
• RoHS Compliance — Device is RoHS compliant.
• Family-Level Performance and Efficiency — Stratix 10 GX family innovations including the Hyperflex core architecture and 14 nm tri-gate technology deliver higher core performance and improved power characteristics for advanced FPGA applications.

Typical Applications

• High-Performance Networking — Implement packet processing, switching and line-rate functions using large logic capacity and extensive I/O.
• Data Center Acceleration — Offload compute-intensive workloads and custom algorithms that benefit from large on-chip memory and logic resources.
• High-Speed Communications — Support demanding transceiver and protocol implementations enabled by the Stratix 10 family’s high-bandwidth capabilities.
• Signal Processing and DSP — Implement real-time DSP pipelines and custom processing engines using the device’s logic and memory resources.

Unique Advantages

• Large Logic Footprint: 2.8 million logic elements provide headroom for complex, integrated designs and multi-function systems on a single FPGA.
• Substantial On-Chip RAM: Over 240 million bits of RAM enable large buffers, look-up tables and state storage without external memory dependence.
• High Pin Count Packaging: 688 I/O and a 1760-ball BGA package support rich external connectivity and high-density board integration.
• Industrial Temperature Support: Rated for −40 °C to 100 °C operation to meet industrial application temperature requirements.
• Family-Level Architectural Gains: Benefits from Stratix 10 innovations such as the Hyperflex core and 14 nm FinFET process, offering improved core performance and energy efficiency.
• RoHS Compliant: Meets regulatory requirements for lead-free manufacturing processes.

Why Choose 1SG280LN3F43I2LGAS?

The 1SG280LN3F43I2LGAS positions itself for systems requiring substantial programmable logic, large on-chip memory and a high I/O count in an industrial-grade FPGA package. It brings Stratix 10 family architectural advantages—improved core performance and efficient process technology—into designs that require scalable compute and bandwidth capabilities.

This device is well suited for engineering teams developing high-bandwidth networking, data center acceleration, communications or advanced signal-processing systems who need a high-density, industrial-temperature FPGA with strong memory and I/O resources and platform-level support from the Stratix 10 family.

Request a quote or submit an inquiry to check pricing and availability for 1SG280LN3F43I2LGAS and discuss how it fits your next design.