1SG280LN3F43E3XG

The 1SG280LN3F43E3XG is a Stratix® 10 GX high-performance FPGA in a 1760-ball FCBGA package. It leverages the Stratix 10 family architecture to deliver a large, flexible logic fabric and extensive high-speed I/O for demanding bandwidth and signal-processing applications.

Built on the Stratix 10 device family innovations, this device combines the Intel Hyperflex core architecture and 14 nm FinFET technology (as described in the Stratix 10 family documentation) with on-chip memory, dense logic resources, and advanced transceiver capability to support networking, compute acceleration, and high-speed communication system designs.

Key Features

• Logic Capacity  Provides 2,800,000 logic elements for complex digital designs and large-scale integration of custom hardware functions.
• On‑Chip Memory  Contains 240,123,904 total RAM bits to support buffering, lookup tables, and local storage for high-throughput data paths.
• I/O and Connectivity  Offers 688 I/O pins to interface with external devices, high-speed transceivers, and board-level peripherals.
• Transceiver and Fabric Innovations  Part of the Stratix 10 GX family which includes Intel Hyperflex core architecture and heterogeneous 3D SiP transceiver tiles (family-level features documented in the Stratix 10 overview).
• Package and Mounting  Supplied in a 1760-BBGA (FCBGA) package; supplier device package specified as 1760-FBGA (42.5 × 42.5 mm). Surface-mount device for compact board layouts.
• Power  Core supply range specified at 820 mV to 880 mV, enabling operation within defined low-voltage core rails.
• Temperature and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for a wide set of commercial and industrial-adjacent applications.
• Standards and Compliance  RoHS compliant.

Typical Applications

• High‑performance networking  Use this FPGA for switch, router, and line-card designs that require dense logic and substantial I/O for packet processing and protocol acceleration.
• Data center acceleration  Deploy the device for hardware acceleration workloads where large on-chip RAM and extensive logic elements support custom compute kernels and streaming data paths.
• Backplane and high-speed interfaces  Leverage the Stratix 10 GX family transceiver architectures (as documented in the device overview) for backplane and module-to-module communications that require high aggregate bandwidth.
• Signal processing and DSP  Implement high-throughput signal-processing pipelines using the device’s large logic and memory resources to support multi-channel real‑time processing.

Unique Advantages

• Large, scalable logic fabric: 2.8 million logic elements enable integration of complex custom logic, reducing external component count and simplifying system architecture.
• Substantial on‑chip memory: 240,123,904 bits of RAM provide local buffering and state storage to minimize external memory bandwidth dependency.
• High I/O density: 688 I/O pins support broad interfacing options for sensors, memory, transceivers, and board-level peripherals.
• Advanced packaging: 1760-ball FCBGA (42.5 × 42.5 mm) supports high pin-count designs while keeping PCB area efficient for dense system boards.
• Power-optimized core rail: Narrow core voltage range (820–880 mV) aligns with modern low-voltage FPGA power architectures for optimized power delivery design.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to support designs that require wider-than-commercial thermal tolerance.

Why Choose 1SG280LN3F43E3XG?

The 1SG280LN3F43E3XG positions itself as a high-capacity Stratix 10 GX FPGA for designs that demand large logic counts, extensive on-chip memory, and high I/O density in a compact FCBGA package. It is suited to engineers building networking equipment, data-center accelerators, high-speed communication modules, and complex signal-processing systems that benefit from deep, programmable logic and local RAM.

Choosing this device provides a path to consolidate functionality into a single programmable device, leveraging the Stratix 10 family’s architecture and documented advanced transceiver and fabric capabilities to scale designs while maintaining a clear supply-chain and compliance profile (RoHS compliant, extended temperature grade).

Request a quote or submit an RFQ to obtain pricing and availability for 1SG280LN3F43E3XG.