1SG280LN3F43E3VGAS

The 1SG280LN3F43E3VGAS is a Stratix® 10 GX field-programmable gate array (FPGA) in a 1760‑ball BGA (FCBGA) package. It pairs the Stratix 10 Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) technology with high logic density and extensive on‑chip memory for demanding, high‑performance applications.

Designed for applications that require large programmable fabric, high I/O bandwidth and advanced transceiver capabilities, this device targets systems that need significant compute and memory resources while operating within a 0 °C to 100 °C range and a 770 mV to 970 mV core supply window.

Key Features

• Core Architecture Intel Hyperflex core architecture implemented in Stratix® 10 GX silicon, delivering the family’s enhanced core performance characteristics.
• Logic Capacity 2,800,000 logic elements to support large, complex designs and high levels of integration on a single device.
• On‑Chip Memory 240,123,904 total RAM bits for deep on‑chip buffering, large data sets and memory‑intensive algorithms.
• I/O and Connectivity 688 I/O pins providing broad external interfacing options and system connectivity.
• High‑Speed Transceivers (Family Features) Stratix 10 GX devices include heterogeneous transceiver tiles and high data‑rate channel options as described in the device family overview.
• Power Supply Core supply operating range from 770 mV to 970 mV to match system power architectures.
• Package 1760‑ball BGA (FCBGA) — supplier package listed as 1760‑FBGA with a 42.5 × 42.5 mm footprint for surface‑mount assembly.
• Temperature Grade Extended grade operation from 0 °C to 100 °C suitable for many commercial and enterprise applications.
• Compliance RoHS‑compliant material set.

Typical Applications

• Data center networking and acceleration — High logic density and large on‑chip RAM enable packet processing, network functions and hardware acceleration tasks.
• Telecommunications and infrastructure — Extensive I/O and Stratix 10 family transceiver capabilities support line cards and backplane interfaces.
• High‑performance compute and DSP — Large logic element count and abundant RAM support compute‑intensive signal processing and FPGA‑based acceleration.
• Advanced prototyping and complex system integration — The device’s capacity and package support large system prototypes and multi‑function FPGA implementations.

Unique Advantages

• High programmable capacity: 2.8 million logic elements provide headroom for large, integrated designs and consolidation of multiple functions onto one device.
• Substantial on‑chip memory: 240,123,904 total RAM bits reduce external memory dependency and improve latency for data‑intensive tasks.
• Broad external connectivity: 688 I/O pins enable flexible system interfaces and extensive peripheral support.
• Package and assembly readiness: 1760‑ball FCBGA package in a 42.5 × 42.5 mm footprint suitable for surface‑mount assembly in high‑density boards.
• Operational alignment with system power: Core voltage range of 770 mV–970 mV allows integration into modern low‑voltage power rails.
• Regulatory and environmental compliance: RoHS compliance supports environmentally conscious designs and global distribution requirements.

Why Choose 1SG280LN3F43E3VGAS?

This Stratix® 10 GX FPGA combines a high‑performance Hyperflex architecture with large logic and memory resources in a compact FCBGA package, offering a scalable platform for complex, bandwidth‑intensive designs. Its mix of programmable fabric capacity, substantial on‑chip RAM and extensive I/O makes it well suited for networking, compute acceleration, telecommunications and advanced prototyping where consolidation and high integration are priorities.

Backed by Intel Stratix 10 family innovations and documented device capabilities, 1SG280LN3F43E3VGAS provides a robust foundation for designs that require significant programmable resources while conforming to extended temperature and RoHS requirements.

Request a quote or contact sales to discuss incorporating 1SG280LN3F43E3VGAS into your next design and to obtain availability and pricing information.