1SG280LN3F43E2LGS3

The 1SG280LN3F43E2LGS3 is a Stratix® 10 GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package. It delivers large logic capacity, extensive on-chip memory, and high I/O density for advanced, high-performance applications.

Built on the Stratix 10 family architecture, this device benefits from Intel® Stratix® 10 innovations such as the Intel Hyperflex™ core architecture and 14 nm tri-gate process technology, enabling designs that require significant compute, bandwidth, and integration.

Key Features

• Logic Capacity  2,800,000 logic elements provide high-density programmable fabric for complex digital designs.
• On‑chip Memory  240,123,904 total RAM bits of embedded memory to support large buffering, lookup tables, and state storage.
• I/O Density  688 user I/O pins allow dense external connectivity for memory interfaces, high-speed links, and board-level peripherals.
• Package & Mounting  1760‑BBGA (FCBGA) package, supplier device package 1760‑FBGA (42.5 × 42.5 mm), surface mount for compact, high-density board designs.
• Power and Operating Range  Core voltage supply range 820 mV to 880 mV and operating temperature range 0 °C to 100 °C; device is specified as Extended grade.
• Stratix 10 Family Innovations  Family-level features include the Intel Hyperflex core architecture, 14 nm tri-gate technology, high-performance transceiver capabilities, and advanced DSP and memory subsystem technologies.
• High‑Speed Transceiver and IP Support (Family)  Stratix 10 family-level transceiver and hard-IP features support high-bandwidth serial links and protocol IP used in networking and compute applications.
• Standards and Compliance  RoHS compliant.

Typical Applications

• High‑Performance Networking  Suitable for switching, routing and line-card implementations that require high I/O density and large programmable logic capacity.
• Data Center & Compute Acceleration  FPGA-based acceleration tasks and custom compute engines that leverage large logic resources and on-chip memory.
• Signal Processing and DSP  Processing pipelines and high-throughput DSP functions that require significant embedded memory and logic parallelism.
• High‑Bandwidth Memory Interfaces  Designs that need dense external interfaces and on-chip resources to manage memory traffic and buffering.

Unique Advantages

• High Logic Density: 2,800,000 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Large Embedded Memory: 240 million+ bits of on-chip RAM reduce the need for external memory and improve data locality and throughput.
• Extensive I/O Capacity: 688 I/O pins provide flexibility for multi-channel interfaces, memory buses, and board-level connectivity.
• Advanced Family Architecture: Benefits from Stratix 10 family technologies such as the Hyperflex core architecture and 14 nm process, delivering improved core performance and efficiency at the family level.
• Compact, Production-Ready Package: 1760‑BBGA FCBGA package (42.5 × 42.5 mm) supports high-density PCB layouts while enabling robust surface-mount assembly.
• Compliance and Grade: RoHS compliant and specified as Extended grade with a 0 °C to 100 °C operating range for demanding commercial and enterprise applications.

Why Choose 1SG280LN3F43E2LGS3?

This Stratix® 10 GX device is positioned for designs that require very large programmable logic capacity, significant on-chip memory, and high I/O counts. It is appropriate for system architects and FPGA designers building high-performance networking, compute acceleration, and signal-processing solutions who need a single-device platform with substantial resources.

As part of the Stratix 10 family, the 1SG280LN3F43E2LGS3 aligns with family-level architecture and IP innovations, offering scalability for growth and design reuse across related Stratix 10 devices.

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