1SG280LN3F43E2VGS3

IC FPGA 688 I/O 1760FBGA
Part Description

Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

Quantity 588 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FBGA (42.5x42.5)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O688Voltage770 mV - 970 mV
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs350000Number of Logic Elements/Cells2800000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits240123904

Overview of 1SG280LN3F43E2VGS3 – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA

The 1SG280LN3F43E2VGS3 is an Intel Stratix® 10 GX FPGA packaged in a 1760-FBGA (42.5 × 42.5 mm) surface-mount package. It provides large programmable logic capacity together with extensive I/O and on-chip memory for high-bandwidth, compute‑intensive designs.

Built on the Stratix 10 GX family architecture, the device leverages Intel’s Hyperflex core architecture and family-level innovations to deliver higher core performance and improved power efficiency for applications that demand high logic density, abundant RAM, and robust I/O.

Key Features

  • Core Architecture  All-new Intel Hyperflex core architecture used in the Stratix 10 GX family, designed to improve core performance and efficiency.
  • Logic Capacity  2,800,000 logic elements (cells) to implement large, complex FPGA designs.
  • On‑Chip Memory  240,123,904 total RAM bits of embedded memory for buffering, packet processing, and large-data working sets.
  • I/O  688 I/O pins for broad peripheral, memory, and high-speed interface connectivity.
  • Transceiver and High‑Speed IP (family features)  Stratix 10 GX family transceivers and IP include high-performance channel architecture with transceiver data rates reported up to 28.3 Gbps and hard IP blocks such as PCI Express and 10G Ethernet (family-level capabilities documented in the Stratix 10 GX overview).
  • DSP and Compute (family features)  Variable precision DSP blocks and hard floating-point options described for the Stratix 10 family to support demanding signal processing and compute tasks.
  • Package and Mounting  1760-FBGA (42.5 × 42.5 mm) package case; surface-mount device suitable for compact, high-density board designs.
  • Power and Voltage  Core supply voltage range documented at 770 mV to 970 mV to support voltage-optimized designs.
  • Thermal and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for a wide range of commercial and industrial-class deployments.
  • Compliance  RoHS‑compliant component.

Typical Applications

  • High‑Performance Networking and Switching  Use the device’s large logic capacity, extensive I/O, and Stratix 10 family transceiver/IP capabilities to implement packet processing, switching fabrics, and protocol offload functions.
  • Data Center Acceleration  Leverage abundant logic elements and on‑chip RAM for FPGA-based accelerators, dataflow engines, and inline compute tasks.
  • High‑Bandwidth Signal Processing  Deploy the family’s DSP resources and large embedded memory for real‑time signal processing, telemetry, and modulation/demodulation workflows.
  • Backplane and Interconnect Systems  Combine the 688 I/O pins and high-speed transceiver capabilities (family-level) for board-to-board and backplane connectivity solutions.

Unique Advantages

  • High Logic Density: 2.8M logic elements enable complex, large-scale designs without immediate need for multi-FPGA partitioning.
  • Large On‑Chip Memory: 240,123,904 total RAM bits support deep buffering, large lookup tables, and high-throughput data paths.
  • Extensive I/O Count: 688 I/O pins provide flexibility for multi-channel interfaces, memory buses, and peripheral connectivity.
  • Advanced Packaging: 1760-FBGA (42.5 × 42.5 mm) package supports dense pinout and compact board integration.
  • Power‑Optimized Core Voltage: 770–970 mV supply range enables designs targeting power efficiency at the core.
  • Extended Temperature Grade: 0 °C to 100 °C operating range supports deployment in a wide set of environments.

Why Choose 1SG280LN3F43E2VGS3?

The 1SG280LN3F43E2VGS3 brings together the Stratix 10 GX family’s architectural advances—such as the Hyperflex core approach and documented high-performance transceiver and IP capabilities—with a specific device-level offering of 2.8 million logic elements, large on-chip RAM, and 688 I/O pins in a 1760-FBGA package. This combination positions the device for demanding designs that require high logic density, substantial embedded memory, and broad connectivity.

Choose this Stratix 10 GX FPGA when your project needs scalable compute and I/O capacity with the ecosystem and family-level features documented for Stratix 10 GX devices. Its extended grade, RoHS compliance, and compact FBGA package support robust, production-ready deployments.

Request a quote or contact our sales team to discuss availability, lead times, and pricing for the 1SG280LN3F43E2VGS3.

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