1SG280LN3F43E2VGS3
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 588 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN3F43E2VGS3 – Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA
The 1SG280LN3F43E2VGS3 is an Intel Stratix® 10 GX FPGA packaged in a 1760-FBGA (42.5 × 42.5 mm) surface-mount package. It provides large programmable logic capacity together with extensive I/O and on-chip memory for high-bandwidth, compute‑intensive designs.
Built on the Stratix 10 GX family architecture, the device leverages Intel’s Hyperflex core architecture and family-level innovations to deliver higher core performance and improved power efficiency for applications that demand high logic density, abundant RAM, and robust I/O.
Key Features
- Core Architecture All-new Intel Hyperflex core architecture used in the Stratix 10 GX family, designed to improve core performance and efficiency.
- Logic Capacity 2,800,000 logic elements (cells) to implement large, complex FPGA designs.
- On‑Chip Memory 240,123,904 total RAM bits of embedded memory for buffering, packet processing, and large-data working sets.
- I/O 688 I/O pins for broad peripheral, memory, and high-speed interface connectivity.
- Transceiver and High‑Speed IP (family features) Stratix 10 GX family transceivers and IP include high-performance channel architecture with transceiver data rates reported up to 28.3 Gbps and hard IP blocks such as PCI Express and 10G Ethernet (family-level capabilities documented in the Stratix 10 GX overview).
- DSP and Compute (family features) Variable precision DSP blocks and hard floating-point options described for the Stratix 10 family to support demanding signal processing and compute tasks.
- Package and Mounting 1760-FBGA (42.5 × 42.5 mm) package case; surface-mount device suitable for compact, high-density board designs.
- Power and Voltage Core supply voltage range documented at 770 mV to 970 mV to support voltage-optimized designs.
- Thermal and Grade Extended grade with an operating temperature range of 0 °C to 100 °C for a wide range of commercial and industrial-class deployments.
- Compliance RoHS‑compliant component.
Typical Applications
- High‑Performance Networking and Switching Use the device’s large logic capacity, extensive I/O, and Stratix 10 family transceiver/IP capabilities to implement packet processing, switching fabrics, and protocol offload functions.
- Data Center Acceleration Leverage abundant logic elements and on‑chip RAM for FPGA-based accelerators, dataflow engines, and inline compute tasks.
- High‑Bandwidth Signal Processing Deploy the family’s DSP resources and large embedded memory for real‑time signal processing, telemetry, and modulation/demodulation workflows.
- Backplane and Interconnect Systems Combine the 688 I/O pins and high-speed transceiver capabilities (family-level) for board-to-board and backplane connectivity solutions.
Unique Advantages
- High Logic Density: 2.8M logic elements enable complex, large-scale designs without immediate need for multi-FPGA partitioning.
- Large On‑Chip Memory: 240,123,904 total RAM bits support deep buffering, large lookup tables, and high-throughput data paths.
- Extensive I/O Count: 688 I/O pins provide flexibility for multi-channel interfaces, memory buses, and peripheral connectivity.
- Advanced Packaging: 1760-FBGA (42.5 × 42.5 mm) package supports dense pinout and compact board integration.
- Power‑Optimized Core Voltage: 770–970 mV supply range enables designs targeting power efficiency at the core.
- Extended Temperature Grade: 0 °C to 100 °C operating range supports deployment in a wide set of environments.
Why Choose 1SG280LN3F43E2VGS3?
The 1SG280LN3F43E2VGS3 brings together the Stratix 10 GX family’s architectural advances—such as the Hyperflex core approach and documented high-performance transceiver and IP capabilities—with a specific device-level offering of 2.8 million logic elements, large on-chip RAM, and 688 I/O pins in a 1760-FBGA package. This combination positions the device for demanding designs that require high logic density, substantial embedded memory, and broad connectivity.
Choose this Stratix 10 GX FPGA when your project needs scalable compute and I/O capacity with the ecosystem and family-level features documented for Stratix 10 GX devices. Its extended grade, RoHS compliance, and compact FBGA package support robust, production-ready deployments.
Request a quote or contact our sales team to discuss availability, lead times, and pricing for the 1SG280LN3F43E2VGS3.

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