1SG280LN3F43E1VGAS
| Part Description |
Stratix® 10 GX Field Programmable Gate Array (FPGA) IC 688 2800000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,076 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FBGA (42.5x42.5) | Grade | Extended | Operating Temperature | 0°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 688 | Voltage | 770 mV - 970 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 350000 | Number of Logic Elements/Cells | 2800000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 240123904 |
Overview of 1SG280LN3F43E1VGAS – Stratix® 10 GX FPGA, 2,800,000 logic elements, 688 I/O
The 1SG280LN3F43E1VGAS is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It combines a high-density logic fabric with large embedded RAM and a broad set of I/O to address demanding high-performance and high-bandwidth applications.
Built on family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, this device is targeted at system designs that require extensive programmable logic, on-chip memory, and high-speed transceiver and interface capability.
Key Features
- Core architecture All-new Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology as described for the Stratix 10 family.
- Logic resources 2,800,000 logic elements (LEs) to support large-scale custom logic and complex processing pipelines.
- On-chip memory 240,123,904 total RAM bits to store large data sets, buffers, and state tables directly in the FPGA fabric.
- I/O and package 688 user I/O pins in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm supplier package) surface-mount package for dense board-level integration.
- Voltage and power Operating core supply range of 770 mV to 970 mV to match system power rails and enable platform-level power planning.
- Temperature and grade Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in controlled-environment systems.
- High-speed transceivers and SiP technology Family-level support for heterogeneous 3D SiP transceiver tiles and transceiver data rates up to 28.3 Gbps (as described in the Stratix 10 GX/SX overview).
- Hard IP and interfaces Family features include hard PCI Express Gen3 x16 IP blocks, hard 10G Ethernet FEC per transceiver channel, and hard memory controllers supporting DDR4 up to 2666 Mbps per pin.
- DSP and processing capabilities Family-level variable-precision DSP blocks and SoC options with a quad-core 64-bit Arm Cortex-A53 are described in the Stratix 10 overview.
- Compliance RoHS compliant for lead-free manufacturing processes.
Typical Applications
- High-performance networking and telecommunications Use the device where large logic capacity, high-speed transceivers, and robust I/O are needed for packet processing, switching, and protocol offload.
- Data center acceleration Deploy the FPGA as a programmable accelerator for compute-intensive functions that benefit from large on-chip RAM and dense logic.
- High-speed I/O and backplane systems Integrate in systems that require many I/O pins and high-speed serial links for board-to-board or backplane connectivity.
- Signal processing and DSP Implement large DSP pipelines and buffering using the device's extensive logic resources and internal RAM.
Unique Advantages
- Massive programmable capacity: 2.8 million logic elements provide the headroom for complex custom logic, deep pipelining, and large-scale designs.
- Large on-chip memory: Over 240 million bits of RAM reduce external memory dependence and improve latency for buffering and lookup tasks.
- Extensive I/O in a compact package: 688 I/O pins in a 1760-BBGA package enable high-density board-level designs while preserving a standard surface-mount footprint.
- Designed for high-bandwidth systems: Family-level transceiver and hard IP features support integration into demanding communication and data center applications.
- Power supply transparency: Explicit core voltage range (770 mV to 970 mV) simplifies power rail design and system-level power budgeting.
- Regulatory readiness: RoHS compliance supports lead-free manufacturing and global supply chain requirements.
Why Choose 1SG280LN3F43E1VGAS?
The 1SG280LN3F43E1VGAS positions itself as a high-density Stratix 10 GX FPGA option for designs that require a large programmable fabric, substantial on-chip RAM, and abundant I/O. It leverages the Stratix 10 family innovations—such as the Hyperflex architecture and advanced FinFET process—to deliver the capabilities needed in high-performance networking, data center, and signal-processing systems.
Choose this device when your design demands extensive logic and memory resources, flexible high-speed interfacing, and a known family roadmap for scaling to other Stratix 10 variants. The extended-grade temperature range and RoHS compliance support integration into controlled-environment systems with standard manufacturing requirements.
Request a quote or submit an inquiry to receive pricing, availability, and technical support information for 1SG280LN3F43E1VGAS.

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