1SG280LN2F43E2VGAS

The 1SG280LN2F43E2VGAS is an Intel Stratix® 10 GX family FPGA built on the Intel Hyperflex™ core architecture and 14 nm tri-gate (FinFET) technology. This device delivers high logic capacity and dense on-chip memory aimed at demanding, high-bandwidth processing and advanced programmable-system applications.

With a large logic fabric, abundant embedded RAM and extensive I/O, this FCBGA-package FPGA targets designs that require scalable compute, high I/O count and integrated transceiver and hard-IP capabilities from the Stratix 10 series.

Key Features

• Core architecture  Intel Hyperflex™ core architecture implemented in 14 nm tri-gate (FinFET) technology for the Stratix 10 family.
• Logic capacity  2,800,000 logic elements to implement large-scale digital designs and complex custom pipelines.
• Embedded memory  240,123,904 total RAM bits of on-chip memory; family includes M20K internal SRAM memory blocks for efficient data buffering and storage.
• I/O and transceivers  688 user I/O pins; Stratix 10 family offers heterogeneous 3D SiP transceiver tiles and transceiver data rates described in the device overview.
• Hard IP and DSP  Stratix 10 series device overview documents include hard PCI Express and high-performance variable-precision DSP block capabilities for demanding compute and interface functions.
• Power and voltage  Core voltage supply range of 770 mV to 970 mV to support the device’s power domains.
• Package and mounting  1760-BBGA (FCBGA) package supplied as 1760-FBGA (42.5 × 42.5 mm); surface-mount device for board-level integration.
• Temperature and grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-speed networking and switching  Large logic capacity, abundant on-chip RAM and Stratix 10 transceiver capabilities support packet processing, forwarding and high-bandwidth link implementations.
• Data center acceleration  High logic density and DSP resources enable custom acceleration engines and inline data processing for storage and compute offload.
• Telecommunications  Extensive I/O and hard IP options in the Stratix 10 family support complex PHY, protocol and backplane interface designs.

Unique Advantages

• High logic density: 2.8 million logic elements provide the capacity to integrate large, multi-stage designs on a single device, reducing board-level component count.
• Large embedded memory footprint: 240+ million bits of on-chip RAM enable deep buffering and high-throughput data paths without relying solely on external memory.
• Extensive I/O in a compact package: 688 I/O pins in a 1760-FBGA (42.5 × 42.5 mm) package support dense system integration while maintaining a manageable PCB footprint.
• Stratix 10 family system features: Family-level innovations such as Hyperflex architecture, M20K SRAM blocks and hard IP options provide a framework for high-performance designs.
• Controlled power domain: Defined core voltage range (770 mV–970 mV) supports predictable power design and supply planning.
• Extended temperature operation: Rated 0 °C to 100 °C for applications that require extended-grade thermal performance.

Why Choose 1SG280LN2F43E2VGAS?

The 1SG280LN2F43E2VGAS combines the Stratix 10 GX family’s Hyperflex architecture and 14 nm FinFET process with a high logic element count and substantial on-chip RAM to address complex, high-bandwidth programmable system requirements. Its package and I/O density make it suitable for integration into systems demanding compact, high-capacity FPGA resources.

Designers seeking a scalable, performance-oriented FPGA with series-level hard IP, DSP resources and robust memory capacity will find this device a strong platform for advanced networking, data acceleration and communications applications.

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