1SG280LN2F43E2LGS3

The 1SG280LN2F43E2LGS3 is an Intel Stratix® 10 GX field programmable gate array in a 1760-BBGA (1760-FBGA, 42.5 × 42.5 mm) package. This extended-grade, surface-mount FPGA delivers 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 688 user I/O pins for high-density system designs.

As part of the Stratix 10 family, the device leverages the family’s advanced architecture and silicon innovations to address high-bandwidth, high-performance applications that require large amounts of logic, embedded memory and dense I/O in a compact FCBGA footprint.

Key Features

• Logic Capacity  2,800,000 logic elements provide abundant programmable fabric for complex algorithms, large pipelined datapaths and deep logic integration.
• Embedded Memory  240,123,904 total RAM bits of on-chip memory support large buffers, lookup tables and local data storage for high-throughput designs.
• I/O Density & Package  688 user I/O pins in a 1760-BBGA / 1760-FBGA (42.5 × 42.5 mm) package deliver high channel density for multi-lane interfaces and board-level integration.
• Power and Thermal  Supported core voltage range of 820 mV to 880 mV and an operating temperature range of 0 °C to 100 °C (extended grade) for stable operation within specified system environments.
• Family Innovations  Stratix 10 family features cited in the device overview include the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, delivering increased core performance and power efficiency at the family level.
• Transceiver and I/O Technologies (Family)  The Stratix 10 family description highlights heterogeneous 3D SiP transceiver tiles, high-speed transceiver capability and hard IP building blocks (family-level features) for high-bandwidth communications and system integration.
• Compliance  RoHS compliant.

Typical Applications

• High‑performance networking  Dense I/O and large on-chip memory allow implementation of multi‑lane packet processing, switching fabric and line-rate protocol acceleration.
• Data center acceleration  Large logic and memory resources support custom acceleration kernels, inline data processing and protocol offload in rack-mounted and blade platforms.
• Signal processing and DSP  High logic element count and substantial embedded RAM enable complex, variable‑precision DSP functions and real‑time data buffering.
• Platform and system integration  High I/O count and a compact 1760‑FBGA footprint simplify integration of multiple high-speed interfaces and dense mezzanine connections.

Unique Advantages

• Large programmable fabric: 2,800,000 logic elements provide headroom for extensive hardware acceleration, custom pipelines and complex control logic without immediate migration to larger family members.
• Substantial on‑chip memory: 240,123,904 bits of embedded RAM reduce external memory dependency for many buffering and stateful processing tasks, simplifying board design and lowering BOM.
• High channel count I/O: 688 user I/O pins enable multi‑lane, multi-protocol interfacing and dense board-level routing for systems requiring numerous external connections.
• Compact, manufacturable package: 1760-FBGA (42.5 × 42.5 mm) package supports high-density assembly while providing the pinout and thermal footprint expected for advanced FPGA deployments.
• Designed for high-performance family features: As a Stratix 10 GX device, it benefits from family-level advancements such as the Hyperflex core architecture and 14 nm FinFET process that target improved core performance and power characteristics.
• Extended-grade operation: 0 °C to 100 °C operating range and RoHS compliance support deployment in constrained thermal environments and current regulatory requirements.

Why Choose 1SG280LN2F43E2LGS3?

The 1SG280LN2F43E2LGS3 positions itself as a high-capacity Stratix 10 GX FPGA suitable for designs that require a combination of large logic resources, significant on-chip memory and dense I/O in a compact FCBGA package. Its extended-grade specification and family-level architectural innovations make it appropriate for demanding networking, data center and signal‑processing applications where integration and performance are critical.

Choosing this device provides scalability within the Stratix 10 family, a high-density package option (1760-FBGA), and a specification set that supports complex system-level integration while maintaining compliance with RoHS requirements.

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