1SG280HU3F50I3XG

The 1SG280HU3F50I3XG is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 2397-BBGA FCBGA. It delivers a large logic fabric, extensive embedded memory and high I/O density for advanced, high-bandwidth applications.

As a member of the Stratix 10 GX family, this device is built on Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology and targets applications that require significant processing capacity, wide memory resources and robust I/O connectivity in industrial environments.

Key Features

• Core & architecture  Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology as featured across the Stratix 10 GX family for high-performance FPGA implementation.
• Logic capacity  2,800,000 logic elements (LEs) to support large-scale custom logic and complex system functions.
• On-chip memory  240,123,904 total RAM bits of embedded memory to support buffering, packet processing and algorithmic workloads.
• I/O and packaging  704 I/O pins in a 2397-BBGA (FCBGA) package, supplied in a 2397-FBGA, FC (50×50) footprint for high-density board designs.
• Power domain  Core voltage supply specification of 820 mV to 880 mV for the device core domain.
• Operating range & grade  Industrial-grade device rated for operation from −40 °C to 100 °C; RoHS compliant.
• Family-level advanced features  Stratix 10 GX family capabilities include high-speed transceivers, fractional-synthesis and ultra-low jitter PLLs, M20K internal SRAM blocks, hard memory controllers and DSP resources (family-level features described in the device overview).

Typical Applications

• High-speed networking and telecom  Use the device’s large logic fabric, extensive memory and high I/O count to implement packet processing, switch fabrics and line-card functions.
• Data center acceleration  Leverage dense logic and on-chip memory for FPGA-based acceleration tasks where throughput and programmable bandwidth are priorities.
• High-performance signal processing  Large embedded RAM and substantial logic capacity enable implementation of complex DSP chains and custom numeric pipelines.
• Industrial control and automation  Industrial temperature rating and high I/O density support demanding control, monitoring and real-time processing applications.

Unique Advantages

• High logic capacity: 2,800,000 logic elements provide the headroom for large custom designs and integration of multiple subsystems on a single device.
• Substantial embedded memory: 240,123,904 total RAM bits reduce dependency on external memory for many buffering and stateful functions.
• Extensive I/O in a compact package: 704 I/O in a 2397-BBGA FCBGA package supports dense board-level integration and high interconnect bandwidth.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in industrial and harsh-environment systems.
• Controlled core power domain: Core supply defined between 820 mV and 880 mV to match board power design for the device core.
• Built on Stratix 10 innovations: Access to Stratix 10 family technologies such as Hyperflex architecture, FinFET process advantages and family-level transceiver and DSP capabilities.

Why Choose 1SG280HU3F50I3XG?

The 1SG280HU3F50I3XG combines very large logic capacity, substantial embedded memory and high I/O density in a single industrial-grade FCBGA package. It is well suited to designs that require on-chip integration of complex logic, high-throughput data handling and extensive buffering while operating across a wide temperature range.

As part of the Stratix 10 GX family, this device benefits from the family’s architecture and engineering foundation, making it appropriate for system designers targeting scalable, high-performance FPGA implementations with clear specifications for power, temperature and packaging.

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