1SG280HU3F50I1VG

The 1SG280HU3F50I1VG is an Intel Stratix® 10 GX family FPGA in a 2397-BBGA (FCBGA) package, featuring a high logic capacity and extensive on-chip memory. It implements Intel’s Hyperflex core architecture and 14 nm FinFET innovations at the family level, targeting high-bandwidth, high-performance digital designs.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 704 I/O, this device is suited for demanding applications that require dense logic, large embedded memory and a wide range of I/O connectivity, all in an industrial-grade, surface-mount package.

Key Features

• Core Architecture  Family-level Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology are described in the device overview for Stratix® 10 GX, delivering the class-level performance and efficiency innovations of the family.
• Logic Capacity  2,800,000 logic elements provide extensive programmable logic resources for complex algorithms, packet processing and high-density control functions.
• Embedded Memory  240,123,904 total on-chip RAM bits enable large buffering, lookup tables and memory-intensive compute tasks without immediate dependence on external DRAM.
• I/O  704 device I/O pins support broad interface options and high pin-count system integration.
• Package & Mounting  2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC, 50×50) in a surface-mount form factor for compact board-level integration.
• Power  Supported core voltage range from 770 mV to 970 mV to match system power-rail planning and regulator selection.
• Temperature & Grade  Industrial grade operation from -40°C to 100°C for deployment in temperature-challenging environments.
• Standards & Compliance  RoHS compliant for adherence to common environmental requirements.

Typical Applications

• High‑performance networking and switching  Large logic and memory resources with high I/O count support packet processing, complex protocol engines and high-throughput data paths.
• Telecommunications infrastructure  Dense programmable logic and extensive embedded RAM enable implementation of line-rate functions, forward error correction and protocol IP blocks described at the device family level.
• Signal processing and acceleration  High logic element count and on-chip RAM support DSP pipelines, fixed/floating point datapaths and custom acceleration kernels.
• Embedded compute platforms  The Stratix® 10 family overview includes SoC variants and hard-IP features; this device’s logic, memory and I/O density make it suitable for complex FPGA-centric systems.

Unique Advantages

• Very high programmable capacity: 2,800,000 logic elements enable integration of large, system-level functions on a single device, reducing external logic count.
• Large on-chip RAM: 240,123,904 bits of embedded RAM minimize external memory dependence for buffering and lookup operations.
• Extensive I/O footprint: 704 I/Os provide flexibility to connect multiple high-pin-count interfaces directly to the FPGA.
• Industrial temperature range: Rated for -40°C to 100°C, supporting deployments in industrial environments.
• High-density FCBGA package: 2397-BBGA (2397-FBGA, FC 50×50) simplifies high-pin-count board routing in a compact surface-mount form factor.
• Family-level performance and innovation: Built on the Stratix® 10 GX family foundation (Hyperflex architecture, 14 nm FinFET, and advanced transceiver and IP options described in the device overview), enabling designs that leverage those class-level capabilities.

Why Choose 1SG280HU3F50I1VG?

The 1SG280HU3F50I1VG provides a combination of very high logic density, substantial on-chip RAM and a large I/O count in an industrial-grade FCBGA package. It is positioned for engineers building high-throughput networking, telecommunications, DSP acceleration and embedded compute platforms that require dense programmable resources and robust thermal operation.

Backed by the Stratix® 10 GX family architecture and Intel’s documented device features, this FPGA offers designers scalability and integration potential for complex system designs while maintaining RoHS compliance and industrial temperature capability.

Request a quote or submit a purchasing inquiry to evaluate 1SG280HU3F50I1VG for your next high-performance FPGA design.