1SG280HU3F50E3VG

The 1SG280HU3F50E3VG is a high-density Stratix® 10 GX Field Programmable Gate Array (FPGA) offered in a 2397-BBGA FCBGA package. It delivers large on-chip logic and memory resources together with extensive I/O for demanding bandwidth and compute applications.

As part of the Stratix 10 GX family, this device benefits from family-level innovations such as the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process, which target increased core performance and improved power efficiency for data center, networking and high-performance compute applications.

Key Features

• Core Architecture (family-level)  Family innovations include the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) technology, designed to increase core performance and reduce power compared to previous-generation high-performance FPGAs.
• Logic Capacity  2,800,000 logic elements to implement large, complex designs and high-density custom logic.
• On-chip Memory  240,123,904 total RAM bits for buffering, data staging and embedded storage requirements.
• I/O and Transceivers  704 user I/O pins to interface with high-speed peripherals and wide external buses. Family-level transceiver technology supports multi-gigabit serial links and advanced PHY features.
• Hard IP (family-level)  Stratix 10 GX family documentation details available hard IP such as PCI Express Gen1/Gen2/Gen3 and industry-standard protocol blocks to accelerate system integration.
• Power and Voltage  Core supply range 770 mV to 970 mV to match system power architectures and optimize performance/power trade-offs.
• Package and Mounting  2397-BBGA FCBGA (2397-FBGA, FC 50×50) surface-mount package for high-pin-count board layouts.
• Operating Range and Grade  Extended grade with an operating temperature range of 0°C to 100°C and RoHS compliance for regulatory alignment.

Typical Applications

• Network and Telecom Platforms  High logic density and extensive I/O support packet processing, protocol offload and multi-gigabit connectivity in switches, routers and line cards.
• Data Center Acceleration  Large on-chip RAM and abundant logic elements enable custom acceleration engines for compute and storage workloads.
• High-Performance Test & Measurement  Wide I/O count and family-level transceiver capabilities suit high-channel-count acquisition and timing-sensitive instrumentation.
• Communication Infrastructure  Hard IP blocks and high-speed serial capabilities support implementation of communication protocols and interface bridging.

Unique Advantages

• High logic density: 2.8 million logic elements provide the capacity to implement complex algorithms and large-scale digital designs on a single device.
• Large embedded memory: 240,123,904 total RAM bits reduce dependence on external memory for many buffering and data-path needs.
• Extensive I/O: 704 I/O pins enable broad interfacing options for parallel buses, high-pin-count peripherals and board-level routing flexibility.
• Family-level performance innovations: The Stratix 10 GX family leverages Hyperflex architecture and 14 nm FinFET technology to improve core performance and power efficiency versus previous generations.
• System integration options: Documented family hard IP (PCIe, Ethernet, protocol blocks) helps accelerate system design and reduce integration time.
• Production-ready packaging and compliance: 2397-BBGA FCBGA surface-mount package and RoHS compliance support high-density production boards and regulatory requirements.

Why Choose 1SG280HU3F50E3VG?

The 1SG280HU3F50E3VG positions itself for designs that require very high logic capacity, substantial on-chip memory and a large number of I/Os in a single FPGA package. It is suitable for system designers building networking, data center acceleration, communications and high-performance measurement equipment where integrating large custom logic and fast interfaces is essential.

As a member of the Stratix 10 GX family, this device benefits from family-level architectural advances and documented hard IP that help shorten development cycles and provide a scalable path for future design iterations.

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