1SG280HU3F50E3VGS3

The 1SG280HU3F50E3VGS3 is a Stratix® 10 GX family FPGA in a 2397-BBGA (FCBGA) surface-mount package. It delivers a high-density programmable fabric with 2,800,000 logic elements and large on-chip memory, designed for demanding, high-bandwidth digital processing and interface applications.

Built on the Stratix® 10 GX architecture, this device targets systems that require substantial logic capacity, extensive I/O, and platform-level integration while operating within a 0 °C to 100 °C temperature range and a 770 mV to 970 mV core supply window.

Key Features

• High-density Logic Fabric — 2,800,000 logic elements provide ample programmable resources for complex digital designs and large-scale logic integration.
• Large On-chip Memory — 240,123,904 total RAM bits enable substantial buffering, look-up tables, and memory-intensive algorithms without immediate external memory dependency.
• Extensive I/O — 704 general-purpose I/O pins support dense interface requirements for high-speed data connections and multi-channel systems.
• Advanced Family Architecture — Part of the Stratix® 10 GX family, which features the Intel Hyperflex core architecture, Intel 14 nm tri-gate technology, and hardened transceiver and IP blocks (as described in the device family overview).
• Power and Package — Surface-mount 2397-BBGA (2397-FBGA, FC 50×50) package with a core voltage supply range of 770 mV to 970 mV for modern low-voltage FPGA power domains.
• Operating Grade and Compliance — Extended grade operation from 0 °C to 100 °C and RoHS-compliant manufacturing.

Typical Applications

• High-bandwidth Networking — Packet processing, switch/router line cards, and NICs that require large programmable fabrics and extensive I/O for multiple high-speed links.
• Compute Acceleration — Hardware acceleration for signal processing, encryption, and custom compute kernels that benefit from abundant logic elements and on-chip memory.
• Telecommunications Infrastructure — PHY and MAC implementations, protocol offload, and forward error correction leveraging the Stratix family’s hardened transceiver and IP features.
• High-performance Embedded Systems — Systems requiring dense I/O, large memory, and flexible logic for custom control, data plane processing, or platform integration.

Unique Advantages

• Large programmable capacity: 2,800,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: 240,123,904 bits of RAM support deep buffering and memory-centric algorithms, minimizing reliance on external memory.
• High I/O density: 704 I/O pins accommodate wide interfaces and numerous peripherals without compromise.
• Family-level architectural benefits: As part of the Stratix® 10 GX family, the device inherits advanced architectural elements such as the Hyperflex core and family-scale transceiver and IP features described in the device overview.
• Compact, industry-standard package: 2397-BBGA (FCBGA) surface-mount package provides a high pin-count solution in a 50 × 50 mm footprint.
• Compliance and thermal range: RoHS compliance and extended-grade operation from 0 °C to 100 °C simplify qualification for commercial and enterprise systems.

Why Choose 1SG280HU3F50E3VGS3?

This Stratix® 10 GX FPGA part offers a combination of large logic capacity, massive on-chip memory, and high I/O density in a compact FCBGA package—making it well suited for developers building high-bandwidth, compute-intensive platforms. The device aligns with designs that require substantial programmable resources and family-level architectural innovations described in the Stratix® 10 GX overview.

For teams developing networking, telecommunications, acceleration, or complex embedded systems, this FPGA provides a scalable, verifiable building block backed by the Stratix® 10 GX family technical foundation and RoHS-compliant manufacturing.

Request a quote or submit a sales inquiry to get pricing, availability, and technical support for the 1SG280HU3F50E3VGS3.