1SG280HU3F50E3XG

The 1SG280HU3F50E3XG is an Intel Stratix® 10 GX family FPGA offering very high logic density and extensive I/O capacity in a 2397-BBGA FCBGA package. As part of the Stratix 10 GX device family, it leverages family-level innovations such as the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to address demanding bandwidth and processing requirements.

With 2,800,000 logic elements, 240,123,904 bits of on-chip RAM and 704 I/O, this device targets high-performance applications that require deep on-chip memory, large compute fabric, and high interface density while operating from a 0.820–0.880 V supply and an extended 0 °C to 100 °C temperature range.

Key Features

• Core Architecture: Based on Intel Stratix 10 family innovations including the Intel Hyperflex core architecture and 14 nm tri-gate (FinFET) technology for enhanced core performance.
• Logic Capacity: 2,800,000 logic elements provide a very large programmable fabric for complex designs and high-density integration.
• On-Chip Memory: 240,123,904 total RAM bits of embedded memory for large buffering, state storage, and memory-intensive algorithms.
• I/O and High-Speed Interfaces: 704 I/O pins supporting extensive external connectivity; Stratix 10 family transceivers and hard IP options described in the device overview support high-bandwidth links.
• Power and Voltage: Core voltage supply range from 820 mV to 880 mV for the FPGA core.
• Package and Mounting: 2397-BBGA (FCBGA) supplier device package 2397-FBGA, FC (50×50), designed for surface-mount assembly.
• Temperature and Grade: Extended grade operation across 0 °C to 100 °C for applications requiring an extended commercial range.
• Standards and Compliance: RoHS compliant.

Typical Applications

• High-speed networking and telecom: Large logic capacity and family transceiver capabilities support packet processing, switching, and high-bandwidth backplane interfaces.
• Data center acceleration: Dense on-chip memory and logic fabric enable custom accelerators and protocol offload engines for data center and cloud infrastructure.
• Signal processing and compute-intensive tasks: Variable-precision DSP resources in the Stratix 10 family support demanding DSP workloads and high-throughput compute functions.
• High-performance board-level systems: Extensive I/O (704 pins) and a compact 2397-BBGA surface-mount package suit complex board designs requiring numerous external interfaces.

Unique Advantages

• High-density programmable fabric: 2.8 million logic elements give designers the headroom to implement large, integrated systems on a single device and reduce system BOM.
• Substantial on-chip memory: 240,123,904 bits of RAM reduce the need for external memory for many buffering and storage tasks, improving latency and system integration.
• Extensive I/O connectivity: 704 I/O pins enable broad peripheral and protocol support without large external multiplexing or bridging logic.
• Low-voltage core operation: 0.820–0.880 V supply supports the device’s high-performance core while enabling efficient power planning on the host board.
• Package and assembly readiness: 2397-BBGA FCBGA in a 50×50 supplier footprint is specified for surface-mount mounting, streamlining PCB integration.
• Extended operating range: Rated for 0 °C to 100 °C operation and an Extended grade for designs targeting demanding commercial thermal environments.

Why Choose 1SG280HU3F50E3XG?

The 1SG280HU3F50E3XG positions itself for designers who need very high logic density, large embedded RAM, and broad I/O in a single Stratix 10 GX FPGA package. Its specification set—2.8M logic elements, 240M bits of on-chip RAM, 704 I/O, and a compact 2397-BBGA footprint—makes it suitable for advanced networking, data center acceleration, and compute-intensive signal processing tasks.

As part of the Intel Stratix 10 family, this device benefits from documented family-level innovations such as the Hyperflex core architecture and 14 nm tri-gate technology, offering a path for scalable designs that leverage family resources and documentation for long-term project planning.

Request a quote or submit an inquiry to receive pricing and availability information for the 1SG280HU3F50E3XG and to discuss how it fits your next high-performance FPGA design.