1SG280HU3F50E2VGAS

The 1SG280HU3F50E2VGAS is an Intel Stratix® 10 GX family FPGA providing very high logic density and on-chip memory for advanced processing and bandwidth-intensive designs. Built on the Stratix 10 GX series architecture, the device combines the Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology to address demanding applications that require large logic resources, extensive I/O, and substantial on-chip RAM.

This device is targeted at system designs that need high compute density and flexible integration—examples include high-bandwidth communications, compute acceleration, and SoC-class embedded systems—delivering a platform-oriented balance of performance, integration, and power efficiency as documented for the Stratix 10 GX family.

Key Features

• Core architecture  Based on the Intel Stratix 10 GX family and the Hyperflex core architecture with Intel 14 nm tri-gate (FinFET) process technology, enabling the series-level performance and efficiency improvements described in the device overview.
• Logic capacity  2,800,000 logic elements provide a high-density fabric for large, complex designs.
• On-chip memory  240,123,904 total RAM bits of embedded memory, with series-level support for M20K internal SRAM blocks for efficient local storage and buffering.
• I/O and packaging  704 I/O pins in a 2397-BBGA (FCBGA) package (supplier package: 2397-FBGA, FC 50 × 50), surface-mount construction for high-density board implementations.
• Supply and thermal  Core voltage supply range of 770 mV to 970 mV and an operating temperature range of 0 °C to 100 °C; device is graded as Extended and is RoHS compliant.
• High-speed transceiver and IP capabilities (series-level)  The Stratix 10 GX family includes heterogeneous 3D SiP transceiver tiles and high-speed transceiver/PHY capabilities (series-level), with hard IP options such as PCI Express and 10G Ethernet documented in the family overview.
• SoC variant options (series-level)  The Stratix 10 family description includes SoC variants with an embedded hard processor system (HPS) based on a quad-core 64-bit Arm Cortex‑A53 for designs that require integrated application-class processing.

Typical Applications

• High-bandwidth networking and switching  Use the large logic capacity, abundant on-chip RAM, and series-level high-speed transceiver capabilities to implement packet processing, traffic management, and protocol offload engines.
• Data center acceleration  Leverage the device’s logic density and memory resources to implement hardware accelerators for compute, storage, and network functions where high throughput is required.
• High-performance signal processing  Deploy in designs that require dense DSP and memory resources for real-time filtering, beamforming, or other algorithmic workloads.
• SoC-class embedded systems  For designs targeting integrated processing and programmable logic, series-level SoC variants offer an embedded quad-core Arm Cortex‑A53 HPS to combine software and hardware acceleration.

Unique Advantages

• High logic density: 2.8 million logic elements enable large, complex designs and feature-rich implementations without partitioning across multiple devices.
• Substantial on-chip RAM: 240,123,904 total RAM bits provide significant local memory capacity for buffers, lookup tables, and state storage.
• Extensive I/O and robust packaging: 704 I/O in a 2397-BBGA FCBGA package supports dense board-level interfacing and high pin-count system integration.
• Low-voltage core operation: Core supply from 770 mV to 970 mV supports modern low-voltage signaling and power-optimized designs.
• Extended temperature grade and compliance: Extended grade rating with 0 °C to 100 °C operating range and RoHS compliance supports deployment in a wide range of commercial and professional environments.
• Series-level advanced silicon and IP: Stratix 10 GX family innovations—Hyperflex architecture, 14 nm tri-gate technology, and integrated high-speed IP—provide a foundation for high-performance system designs.

Why Choose 1SG280HU3F50E2VGAS?

The 1SG280HU3F50E2VGAS delivers a combination of very high logic capacity, large on-chip memory, and broad I/O resources in a single Stratix 10 GX device package, making it well suited for designs that require dense programmable logic and significant local memory. Its specification aligns with applications that need scalable compute fabric, substantial buffering, and high pin-count connectivity.

Designed around the Stratix 10 GX family architecture and documented series-level features, this device offers a platform-oriented solution for engineers building high-throughput communications, compute-acceleration, and SoC-integrated systems, delivering long-term scalability through the family’s advanced silicon capabilities.

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