1SG280HU3F50E2LGS3

The 1SG280HU3F50E2LGS3 is an Intel Stratix 10 GX FPGA device optimized for high-performance, high-bandwidth designs. Built on the Stratix 10 GX family architecture, the device leverages Intel Hyperflex core innovations and 14 nm tri-gate (FinFET) technology to deliver advanced programmable logic, on-chip memory, and a wide complement of high-speed interface capabilities.

This extended-grade, surface-mount FCBGA packaged FPGA is aimed at demanding applications that require large logic capacity, substantial embedded RAM, and dense I/O connectivity while operating in a 0 °C to 100 °C range.

Key Features

• Logic Capacity  2,800,000 logic elements to implement large-scale programmable logic and complex processing pipelines.
• On-chip Memory  240,123,904 total RAM bits of embedded memory for deep buffering, large lookup tables, and state storage.
• I/O Density  704 I/O pins to support dense external connectivity and multiple high-speed interfaces.
• Process & Core Architecture  Intel Hyperflex core architecture on 14 nm tri-gate (FinFET) technology, providing the family-level improvements in core performance described in the Stratix 10 GX overview.
• High-speed Transceiver and Interface Capability  Family-level features include heterogeneous transceiver tiles and high-rate serial links (family documentation cites transceiver rates up to 28.3 Gbps and hard PCI Express Gen3 IP); use the device’s I/O and transceiver resources to implement high-bandwidth links and protocol IP.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV, matching the device’s specified operating domain.
• Package & Mounting  2397-BBGA FCBGA package (supplier package: 2397-FBGA, FC 50×50) in a surface-mount form factor for board-level integration.
• Operating Range  Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Reliability & Security Features (Family)  Stratix 10 family-level features include device configuration options, secure device management, and SEU detection and correction mechanisms as described in the device overview.

Typical Applications

• Data Center Networking  High I/O count and family-level transceiver capabilities support implementation of high-bandwidth switching, linecards, and packet-processing accelerators.
• High-performance Computing & Acceleration  Large logic element count and extensive on-chip RAM enable custom compute pipelines, DSP acceleration, and application-specific accelerators.
• Telecommunications & Backplane Systems  Use the device’s dense I/O and family-level serial interface features for backplane PHYs, FEC, and multi-channel transport designs.
• Data Acquisition & Processing  Large embedded memory and logic capacity support high-channel-count data capture, real-time processing, and buffering tasks.

Unique Advantages

• Very high logic density: 2.8 million logic elements provide the capacity to implement large, complex designs on a single device, reducing multi-chip system complexity.
• Substantial embedded memory: 240,123,904 RAM bits enable deep buffering and local data storage to accelerate streaming and packetized workflows.
• Dense I/O and package integration: 704 I/O in a 2397-BBGA FCBGA package allows compact board designs with extensive external connectivity.
• Advanced process and architecture: Intel Hyperflex architecture and 14 nm FinFET family characteristics provide improved core performance and architectural capability as documented for the Stratix 10 GX family.
• Designed for high-bandwidth systems: Family-level transceiver and hard IP capabilities support implementation of PCI Express, Ethernet, and other high-speed protocols.
• Extended-grade operating range: Rated for 0 °C to 100 °C operation to match a broad set of deployment environments.

Why Choose 1SG280HU3F50E2LGS3?

The 1SG280HU3F50E2LGS3 brings large-scale programmable logic, extensive on-chip memory, and high I/O density in a single Stratix 10 GX FCBGA package. It is suited for designers who need to consolidate complex, high-throughput functions—such as packet processing, custom accelerators, or high-channel data capture—onto a single device while taking advantage of the Stratix 10 family’s architectural enhancements.

Choosing this device provides a scalable platform for advanced system designs that require a combination of logic capacity, memory, and interface density, backed by the Stratix 10 family-level features for performance, transceiver capability, and device management.

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