1SG280HU2F50I2VG

The 1SG280HU2F50I2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) delivering 2,800,000 logic elements and extensive on‑chip memory for demanding, high‑performance designs. Built on the Stratix 10 GX family architecture, it combines Intel Hyperflex core architecture and Intel 14 nm tri‑gate (FinFET) process innovations to address bandwidth‑ and compute‑intensive applications.

With 704 I/O pins, 240,123,904 total RAM bits, and a 2397‑BBGA FCBGA package in a surface‑mount form factor, this industrial‑grade device targets applications that require high logic density, large embedded memory, and robust operating conditions.

Key Features

• Core & architecture — Intel Hyperflex core architecture and 14 nm tri‑gate (FinFET) process as part of the Stratix 10 GX family, providing the architectural foundation for high core performance and efficiency.
• Logic density — 2,800,000 logic elements to implement large, complex logic designs and high‑capacity datapaths.
• Embedded memory — 240,123,904 total RAM bits of on‑chip memory to support large buffering, tables, and state storage.
• I/O and connectivity — 704 I/O pins to support wide parallel interfaces and numerous external peripherals.
• Package & mounting — 2397‑BBGA (2397‑FBGA, FC 50×50) surface‑mount package for high‑density board integration.
• Power supply — Core voltage range 770 mV to 970 mV for core power management and system compatibility.
• Operating range — Industrial operating temperature from −40 °C to 100 °C for use in temperature‑challenging environments.
• Family‑level transceiver and system features — Stratix 10 GX family innovations include heterogeneous 3D SiP transceiver tiles, high‑speed transceivers and advanced PLLs as described in the device overview.

Typical Applications

• High‑performance networking — Implement switch fabric, packet processing, and protocol offloads using the device’s high logic density and large on‑chip memory.
• Data center acceleration — Deploy for compute offload, custom accelerators, and hardware‑level data processing where large logic and memory resources are required.
• Telecommunications and backplane systems — Use for high‑bandwidth link aggregation, optical module interfacing, and complex PHY/MAC implementations leveraging extensive I/O and family transceiver features.
• Test, measurement, and instrumentation — Build high‑channel‑count signal processing and real‑time analysis systems using the device’s memory and logic capacity.

Unique Advantages

• Massive logic capacity: 2.8 million logic elements enable consolidation of multi‑function designs into a single device, reducing board count and interconnect complexity.
• Large on‑chip memory: 240,123,904 RAM bits provide substantial buffering and table storage for high‑throughput data paths and stateful processing.
• High I/O density: 704 I/Os allow flexible interfacing to high‑pin‑count peripherals and parallel buses without external I/O expanders.
• Industrial temperature rating: −40 °C to 100 °C operating range supports deployment in industrial environments with wide thermal variations.
• Robust packaging for dense PCBs: 2397‑BBGA FCBGA surface‑mount package suits compact, high‑density system boards.
• Family technology heritage: Leveraging Stratix 10 GX family innovations such as Hyperflex architecture and 14 nm FinFET process provides a known platform for high‑performance designs.

Why Choose 1SG280HU2F50I2VG?

The 1SG280HU2F50I2VG is positioned for engineers and system designers who require substantial logic resources, large embedded memory, and extensive I/O in an industrial‑rated FPGA. Its Stratix 10 GX family architecture brings advanced core technology and device‑level features that help implement complex, high‑bandwidth systems on a single programmable device.

Choosing this device supports scalable, long‑life designs that benefit from high integration, reduced board complexity, and proven Stratix 10 family capabilities for demanding networking, data center, telecom, and instrumentation applications.

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