1SG280HU2F50I1VG

The 1SG280HU2F50I1VG is an Intel Stratix 10 GX FPGA designed for high‑performance, bandwidth‑intensive applications. It combines the Stratix 10 GX family architecture with a high logic density and large on‑chip memory to address advanced networking, compute acceleration, and signal processing use cases.

This device provides 2,800,000 logic elements, 240,123,904 bits of total on‑chip RAM, and 704 I/O pins in a 2397‑BBGA FCBGA package. It is specified for industrial operation from -40 °C to 100 °C and operates with a core supply in the 770 mV to 970 mV range.

Key Features

• Core architecture Based on the Intel Stratix 10 GX family and its Hyperflex core architecture as described in the device overview, delivering the series’ high‑performance fabric.
• Logic capacity 2,800,000 logic elements for dense, complex FPGA designs and high compute parallelism.
• On‑chip memory 240,123,904 total RAM bits to support large buffering, state machines, and memory‑intensive functions.
• I/O and high‑speed interfaces 704 I/O pins in a 2397‑BBGA FCBGA package to support extensive external connectivity; the Stratix 10 family overview documents advanced transceiver and PCI Express hard IP options for high‑bandwidth systems.
• Power supply Core voltage supply range of 770 mV to 970 mV to match system power‑management strategies.
• Package and mounting 2397‑BBGA (2397‑FBGA, 50 × 50) surface‑mount package suitable for compact, high‑density board designs.
• Temperature and grade Industrial grade device rated for −40 °C to 100 °C operation.
• Standards and compliance RoHS compliant.

Typical Applications

• High‑speed networking and telecom Use the abundant I/O and Stratix 10 family transceiver capabilities to implement packet processing, switching, and optical interface logic.
• Data center acceleration Leverage high logic density and on‑chip RAM for custom acceleration tasks and inline data processing in server and appliance designs.
• High‑performance signal processing Large logic and memory resources enable complex DSP pipelines, filtering, and real‑time data manipulation.
• Backplane and board‑level systems The 2397‑BBGA package with 704 I/Os supports dense board integration for modular and chassis‑based systems.

Unique Advantages

• High logic density: 2,800,000 logic elements provide the capacity to implement large, multi‑function designs without partitioning across multiple devices.
• Substantial on‑chip memory: 240,123,904 bits of RAM reduce external memory dependencies and support deep buffering and state storage on‑chip.
• Extensive external connectivity: 704 I/O pins in a compact FCBGA package enable rich peripheral and high‑speed interface integration.
• Industrial temperature rating: Specified −40 °C to 100 °C operation for deployment in demanding environmental conditions.
• Low‑voltage core operation: Core supply range of 770–970 mV supports contemporary power‑management approaches for performance vs. power optimization.
• RoHS compliance: Meets RoHS requirements for environmental and manufacturing conformity.

Why Choose 1SG280HU2F50I1VG?

1SG280HU2F50I1VG positions itself as a high‑density Stratix 10 GX FPGA option for engineers building bandwidth‑ and compute‑intensive systems. With 2.8 million logic elements, hundreds of I/O, and more than 240 million bits of on‑chip RAM, it suits designs that require large programmable fabric and memory resources while meeting industrial temperature requirements.

As part of the Stratix 10 GX family, the device benefits from the series‑level innovations described in the device overview, making it appropriate for customers designing advanced networking, data‑center, and signal‑processing applications that demand integration, scalability, and proven silicon architecture.

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