1SG280HU2F50I2LG

The 1SG280HU2F50I2LG is an Intel Stratix® 10 GX field programmable gate array (FPGA) packaged in a 2397‑BBGA (FCBGA) surface-mount package. It combines 2,800,000 logic elements, 240,123,904 total RAM bits, and 704 I/O pins to address high-performance, bandwidth‑intensive designs.

Built on the Stratix 10 GX family architecture, the device leverages the Intel Hyperflex core approach and 14 nm tri‑gate technology to deliver increased core performance and improved power efficiency for demanding communications, data center, and high‑throughput processing applications.

Key Features

• Core Architecture  Intel Stratix 10 GX family Hyperflex core architecture provides the advanced fabric used across the family and the performance improvements documented for Stratix 10 devices.
• Logic Capacity  2,800,000 logic elements (LEs) suitable for large-scale glue logic, protocol processing, and complex custom accelerators.
• Embedded Memory  240,123,904 total RAM bits to support large buffering, on‑chip data storage, and memory‑intensive logic functions.
• I/O and Integration  704 user I/Os for broad external connectivity and high pin‑count interface requirements.
• Package & Mounting  2397‑BBGA (FCBGA) surface mount package; supplier device package listed as 2397‑FBGA, FC (50×50) for board‑level planning.
• Power Supply  Specified core voltage range from 820 mV to 880 mV to match platform power delivery design.
• Operating Temperature  Industrial grade device rated for −40 °C to 100 °C operation for robust deployment in temperature‑varied environments.
• Standards & Compliance  RoHS compliant per product data.
• Family-Level System Features  Stratix 10 GX family features include advanced transceiver, DSP and hard IP capabilities, fractional synthesis PLLs, and high‑performance I/O architectures as documented for the Stratix 10 GX/SX family.

Typical Applications

• High‑Performance Networking  Multi‑lane interfaces and large logic capacity support protocol offload, packet processing, and line‑card functions in communications equipment.
• Data Center Acceleration  Large logic and embedded memory resources enable compute offload, custom data‑path acceleration, and inline processing in server and appliance designs.
• High‑Speed I/O Systems  Extensive I/O count and family transceiver capabilities make the device suitable for backplane interfaces, high‑bandwidth aggregation, and module‑level connectivity.
• Signal Processing & DSP  Substantial on‑chip memory and logic resources support variable‑precision signal processing engines and real‑time data manipulation.

Unique Advantages

• High Logic Density:  2.8 million logic elements enable implementation of large, complex designs without excessive partitioning.
• Substantial On‑Chip Memory:  240,123,904 total RAM bits provide ample capacity for buffering, lookup tables, and local data storage to reduce external memory dependency.
• Broad I/O Reach:  704 I/Os let you implement multiple parallel interfaces and high‑pin‑count systems on a single device.
• Industrial Temperature Rating:  Rated from −40 °C to 100 °C to support deployment in temperature‑challenging environments.
• Family Innovation Leverage:  Built on Stratix 10 GX family technologies (Hyperflex core, 14 nm tri‑gate) to benefit from documented performance and efficiency enhancements at the family level.
• Regulatory Compliance:  RoHS compliant to meet environmental requirements in product assemblies.

Why Choose 1SG280HU2F50I2LG?

The 1SG280HU2F50I2LG positions itself for designs that require a combination of large logic capacity, substantial on‑chip memory, and high I/O density within an industrial temperature envelope. Its Stratix 10 GX family lineage brings architectural improvements and system‑level features that support high‑throughput and compute‑intensive applications.

This device is suited for engineering teams building advanced communications, data‑center acceleration, and high‑speed I/O systems that need a scalable FPGA resource with documented family capabilities and industrial operating range.

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