1SG280HU3F50E1VGS3

The 1SG280HU3F50E1VGS3 is a Stratix® 10 GX FPGA delivering high logic capacity and dense I/O in a 2397-BBGA FCBGA package. Built on the Stratix® 10 family architecture, this device targets high-bandwidth, compute‑intensive applications that require large internal memory, extensive DSP capability, and high-speed transceiver support.

With 2,800,000 logic elements and 240,123,904 bits of on-chip RAM, the device combines deep programmable fabric with hardened system features to address networking, compute acceleration, and advanced signal-processing designs while operating from a 770 mV to 970 mV core supply and an extended 0 °C to 100 °C temperature range.

Key Features

• Core & Architecture  Stratix® 10 family innovations including the Intel Hyperflex core architecture and Intel 14 nm tri-gate (FinFET) technology provide the underlying fabric for high throughput and efficiency.
• Logic Capacity  2,800,000 logic elements provide extensive programmable resources for complex designs and large-scale integration.
• Embedded Memory  240,123,904 total RAM bits with M20K internal SRAM blocks for deep on-chip buffering and state storage.
• DSP and Compute  Variable precision DSP blocks from the Stratix® 10 family enable high-performance fixed‑ and floating‑point signal processing workloads.
• High-Speed Transceivers & Interfaces  Series-level transceiver capabilities include data rates up to 28.3 Gbps and hardened protocol IP such as PCI Express Gen3, 10G Ethernet, and Interlaken to support high-bandwidth links and backplane connectivity.
• I/O and Memory Interfaces  704 I/O pins and hardened memory controller/PHY support for external DDR4 memory interfaces provide flexible front-end connectivity and memory subsystem integration.
• Power and Operating Range  Core voltage supply range 770 mV to 970 mV with device-grade extended thermal rating from 0 °C to 100 °C.
• Package and Mounting  2397-BBGA, FCBGA package (supplier package: 2397-FBGA, FC 50×50) for surface-mount assembly in space-constrained, high-density designs.
• System Reliability & Security  Family features include configuration management, secure device manager capabilities, and SEU detection and correction mechanisms for improved system robustness.
• Compliance  RoHS compliant.

Typical Applications

• Data Center Acceleration  Offload and accelerate compute-intensive workloads where large logic capacity, high memory bandwidth, and PCI Express connectivity are required.
• Telecommunications & Networking  High-density packet processing, line cards, and backplane interfaces leveraging high-speed transceivers, 10G Ethernet/forward error correction, and extensive I/O.
• High‑Performance Signal Processing  DSP-heavy applications such as imaging, radar, and software‑defined radio that benefit from large DSP resources and substantial on-chip RAM.
• Optical & High‑Speed I/O Modules  Module and board designs that require multi-gigabit serial links and dense I/O in a compact FCBGA package.

Unique Advantages

• High Logic Density: 2,800,000 logic elements enable the integration of large, complex designs and reduce the need for multi‑FPGA solutions.
• Deep On‑Chip Memory: 240,123,904 bits of internal RAM provide substantial buffering and storage for high-throughput pipelines and DSP chains.
• Multi‑Gbps Transceiver Support: Series-level transceivers to 28.3 Gbps and hardened protocol IP let designs meet demanding bandwidth and protocol requirements.
• Robust I/O Count: 704 I/O pins support extensive peripheral, memory, and high-speed interface integration on a single device.
• Package Density: 2397-BBGA (50×50 supplier footprint) delivers high pin density for compact board layouts and system-level integration.
• Extended Operating Range: Extended-grade device rating and a 0 °C to 100 °C operating range for deployment in a variety of controlled-environment systems.

Why Choose 1SG280HU3F50E1VGS3?

The 1SG280HU3F50E1VGS3 positions itself as a high-capacity, high-I/O Stratix® 10 GX FPGA suitable for demanding networking, data-center, and signal-processing designs. Its combination of 2.8 million logic elements, substantial on‑chip RAM, multi‑Gbps transceiver support, and hardened protocol IP enables integrators to consolidate functionality, simplify board architecture, and support high-throughput system requirements.

This device is ideal for engineering teams that need scalable programmable fabric with robust memory and I/O resources, packaged in a dense 2397-BBGA FCBGA footprint and designed to operate across an extended temperature range. The Stratix® 10 family features cited in the device documentation—Hyperflex architecture, 14 nm FinFET process, and advanced transceiver and memory capabilities—support long-term design scalability and system performance.

Request a quote or submit your design inquiry to evaluate 1SG280HU3F50E1VGS3 for your next high-performance FPGA application.