1SG280HU3F50E2LG

The 1SG280HU3F50E2LG is an Intel Stratix® 10 GX field programmable gate array supplied in a 2397-BBGA FCBGA package. This high-density FPGA delivers large on-chip logic and memory resources with extensive I/O, targeting advanced, bandwidth- and compute-intensive applications.

Leveraging the Stratix 10 family architecture and innovations noted in the device overview, the device is suited for designs requiring substantial logic capacity, abundant embedded RAM, and high-pin-count interfacing while operating within an extended grade temperature range.

Key Features

• Logic Capacity  Provides 2,800,000 logic elements for complex custom logic and high-parallelism designs.
• Memory Resources  Includes 240,123,904 total RAM bits of on-chip memory to support large buffering, lookup tables, and state storage.
• I/O Density  704 user I/O pins enable wide external interfacing and high-bandwidth parallel connectivity.
• Stratix 10 Architecture  Part of the Intel Stratix 10 GX family and described in the device overview as leveraging the Intel Hyperflex core architecture and other family-level innovations.
• Power Supply  Operates from a core voltage supply range of 820 mV to 880 mV to match system power rails and power-management strategies.
• Package & Mounting  Supplied in a 2397-BBGA (2397-FBGA, FC; 50×50) surface-mount package for high-density board implementations.
• Operating Conditions  Extended grade with an operating temperature range of 0 °C to 100 °C, suitable for demanding thermal environments within that range.
• RoHS Compliance  Device is RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• High-performance networking  Use the device to implement packet processing, forwarding engines, and protocol offload where large logic and abundant RAM accelerate throughput.
• Data center acceleration  Deploy as a custom accelerator for compute-intensive workloads that benefit from extensive parallel logic and on-chip memory.
• Telecommunications  Ideal for channel processing, fronthaul/backhaul functions, and other telecom tasks requiring high I/O count and significant logic resources.
• Signal processing  Support for large-scale DSP and custom algorithms that require substantial embedded memory and logic capacity.

Unique Advantages

• Large integrated logic pool: 2.8 million logic elements reduce reliance on external ASICs or multiple FPGAs for complex designs.
• Substantial on-chip RAM: Over 240 million RAM bits enable deep buffering and stateful architectures without immediate external memory dependence.
• High I/O count: 704 I/Os allow broad, direct interfacing to high-pin-count peripherals and parallel data paths.
• Industry-proven family innovations: As a Stratix 10 GX device, it leverages family-level architecture advances cited in the device overview to address high-bandwidth and high-performance needs.
• Compact, high-density packaging: The 2397-BBGA surface-mount package supports dense PCB layouts for space-constrained systems.
• Regulatory-ready: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 1SG280HU3F50E2LG?

The 1SG280HU3F50E2LG positions itself as a high-density FPGA option within the Stratix 10 GX family for engineers who need extensive logic, significant on-chip RAM, and a large I/O footprint in a single surface-mount package. Its extended-grade temperature range and RoHS compliance make it suitable for demanding commercial and enterprise-class deployments.

Choose this device when your design requires consolidated logic and memory resources to minimize board-level complexity and when you need a solution aligned with the Stratix 10 family architecture and capabilities described in the device documentation.

Request a quote or submit an inquiry to receive pricing and availability details for 1SG280HU3F50E2LG. Our team will provide the information needed to evaluate integration into your design and procurement process.