1SG280HU3F50E2VGS3

The 1SG280HU3F50E2VGS3 is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It delivers a high-density programmable fabric with 2,800,000 logic elements and extensive on-chip memory, intended for demanding high‑performance and high‑bandwidth applications.

Built on the Stratix 10 family architecture, this device targets system designs that require large logic capacity, substantial internal RAM, and a high count of I/O while operating within an extended temperature grade and a low core voltage range.

Key Features

• Core Architecture  Intel Stratix 10 family innovations including the Intel Hyperflex core architecture are part of the device family overview, delivering enhanced core performance for compute‑intensive designs.
• Logic Capacity  2,800,000 logic elements (logic cells) provide large programmable fabric for complex logic, packet processing, and algorithm implementation.
• On‑Chip Memory  240,123,904 total RAM bits of embedded memory for large buffering, state storage, and memory‑centric accelerators.
• I/O Density  704 I/O pins to support wide external interfaces, multi‑lane links, and dense system connectivity.
• Power and Voltage  Core supply operating range from 770 mV to 970 mV, enabling integration into low‑voltage power domains.
• Package and Mounting  2397‑BBGA FCBGA (supplier device package 2397‑FBGA, FC (50×50)) in a surface‑mount form factor for high‑density board designs.
• Temperature and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C, suitable for applications requiring above‑commercial thermal performance.
• Standards and Compliance  RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High‑Performance Networking  Use the part for packet processing, switch/router line cards, and backplane bridging where large logic capacity and many I/Os are required.
• Data Center Acceleration  Deploy as a hardware accelerator or custom offload engine that benefits from abundant logic resources and substantial on‑chip RAM.
• Telecommunications and Transport  Implement high‑bandwidth protocol processing and forwarding functions that leverage the device’s logic density and I/O count.
• Signal Processing and DSP  Build complex DSP pipelines and algorithmic accelerators using the device family’s variable precision DSP and large embedded memory (as described in the Stratix 10 family overview).

Unique Advantages

• High logic density: 2,800,000 logic elements enable consolidation of large functions into a single FPGA, reducing board-level component count.
• Massive on‑chip RAM: 240,123,904 bits of embedded memory support deep buffering and stateful processing without external memory for many tasks.
• Extensive I/O: 704 I/Os allow flexible interfacing to high‑speed PHYs, multi‑lane links, and dense peripheral arrays.
• Advanced packaging: 2397‑BBGA FCBGA package provides a high I/O and thermal footprint for integration into compact, high‑density PCBs.
• Low core voltage operation: 770 mV to 970 mV core supply range supports modern low‑voltage power architectures and efficient power delivery.
• Extended temperature grade: 0 °C to 100 °C operating temperature provides broader thermal operating range than standard commercial devices.

Why Choose 1SG280HU3F50E2VGS3?

The 1SG280HU3F50E2VGS3 combines a high count of logic elements, substantial embedded RAM, and a large I/O complement in a high‑density FCBGA package. It is positioned for system designs that demand significant programmable resources and flexible connectivity while operating within an extended temperature grade and low core voltage domain.

This FPGA suits engineering teams building high‑bandwidth networking, data center acceleration, telecommunications, and signal processing systems that require scalable logic capacity, robust on‑chip memory, and a compact, manufacturable package backed by the Stratix 10 family architecture.

Request a quote or submit a procurement inquiry to receive pricing, availability, and lead‑time information for the 1SG280HU3F50E2VGS3.