1SG280HU2F50E2VG

The 1SG280HU2F50E2VG is an Intel Stratix® 10 GX field programmable gate array (FPGA) in a 2397-BBGA FCBGA package. It delivers large programmable logic capacity and extensive on-chip memory, targeting advanced applications that require high bandwidth, heavy processing and flexible hardware acceleration.

Built on the Stratix 10 GX family innovations, the device leverages the Intel Hyperflex™ core architecture and Intel 14 nm tri-gate (FinFET) process to address demanding communications and compute use cases while providing a high-density I/O footprint.

Key Features

• Core architecture  Intel Hyperflex core architecture is a documented family innovation that delivers significantly increased core performance versus previous-generation high-performance FPGAs.
• Logic capacity  2,800,000 logic elements, providing large programmable fabric for complex designs and hardware acceleration.
• On-chip memory  240,123,904 total RAM bits and family‑level M20K internal SRAM memory blocks for large buffering, lookup tables and state storage.
• I/O and transceiver capability  704 I/O pins in a high-density I/O configuration; the Stratix 10 family documentation also highlights heterogeneous 3D SiP transceiver tiles and high-speed transceiver support for demanding serial links.
• Hard IP options (family level)  Family documentation includes hard PCI Express Gen3 x16 IP and hardened Ethernet/forward error correction options for common high-speed protocols.
• Process and integration  Intel 14 nm tri-gate (FinFET) technology and Hyperflex innovations enable higher performance and power efficiency at the device family level.
• Power supply range  Supported core voltage range from 770 mV to 970 mV for core power planning and regulator selection.
• Package and mounting  2397-BBGA, FCBGA package (supplier device package: 2397-FBGA, FC 50×50) with surface mount mounting type for high-density board integration.
• Temperature and grade  Extended grade device with an operating temperature range of 0°C to 100°C.
• RoHS compliance  Device is RoHS compliant.

Typical Applications

• High‑performance networking  Implements packet processing, forwarding, and protocol offload where large logic capacity, on-chip memory and high-density I/O are required.
• Data center acceleration  Hardware acceleration for compute and storage tasks that benefit from large FPGA fabric and embedded memory for buffering and stateful operations.
• Telecommunications infrastructure  Backplane and line-card designs that require programmable logic for protocol handling, FEC and high-speed serial connectivity.
• Test and measurement systems  Real-time signal processing and custom instrumentation using the abundant logic elements and on-chip RAM.

Unique Advantages

• Large programmable capacity: 2.8 million logic elements enable integration of complex algorithms and multiple hardware accelerators on a single device.
• Substantial on-chip memory: 240,123,904 RAM bits reduce external memory dependence for many buffering and stateful workloads.
• High-density I/O: 704 I/O pins in a compact FCBGA package support designs with numerous interfaces and parallel buses.
• Modern process and architecture (family level): 14 nm FinFET process combined with Intel Hyperflex core architecture delivers family-documented performance and efficiency improvements.
• Board-level integration: 2397-BBGA (50×50) packaging and surface-mount mounting enable dense, manufacturable PCB layouts for complex systems.
• Compliance and grade: RoHS compliant and extended grade temperature rating support typical commercial and enterprise deployment environments.

Why Choose 1SG280HU2F50E2VG?

The 1SG280HU2F50E2VG brings substantial logic density, large embedded RAM and a high I/O count in a compact 2397-BBGA FCBGA package. It is positioned for engineers developing advanced networking, compute acceleration and communications infrastructure who need on-board resources to implement complex, high-throughput designs.

Supported by Stratix 10 family architecture and documented innovations, this device offers a scalable platform for designs that require significant on-chip resources, modern process advantages and extensive I/O integration—making it suitable for projects where consolidation of functionality into a single FPGA can simplify system architecture and reduce BOM complexity.

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